Inventor · disambiguated record
Seungwan Shin
Also filed as: SHIN SEUNGWAN
2 granted patents·8 pending applications·2 citations·filing 2022–2025
39Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10
Top patents by PatentIndex Score
10 records- 0183US12154859B2Semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 26, 2024·2 cites·20 claims
- 0266US2025286006A1Semiconductor package including an encapsulantSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0365US2025054870A1Semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0458US12341118B2Semiconductor package including an encapsulantSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 0556US2025218916A1Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0655US2024204026A1Image sensor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0755US2024213174A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0855US2025038122A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0948US2024234268A9Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1047US2023326871A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Seungwan Shin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →