Inventor · disambiguated record
Seung Wan Shin
Also filed as: SHIN SEUNG WAN
4 granted patents·5 pending applications·54 citations·filing 2009–2019
73Inventor score
Files withSAMSUNG ELECTRO MECH4PARK SEUNG WOOK2KANG JOON SEOK1KIM YOON SU1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
9 records- 0194US10347585B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 9, 2019·47 cites·23 claims
- 0270US8582314B2Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structurePARK SEUNG WOOK·Filed 2010·Granted Nov 12, 2013·3 cites·5 claims
- 0369US9196506B2Method for manufacturing interposerSAMSUNG ELECTRO MECH·Filed 2012·Granted Nov 24, 2015·2 cites·8 claims
- 0467US10685916B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 16, 2020·2 cites·17 claims
- 0552US2011061911A1Interposer and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0639US2012084977A1Method of manufacturing block modulePARK SEUNG WOOK·Filed 2011·Application pending·0 cites
- 0736US2012161323A1Substrate for package and method for manufacturing the sameKIM YOON SU·Filed 2011·Application pending·0 cites
- 0836US2013139753A1Apparatus for manufacturing substrateKANG JOON SEOK·Filed 2012·Application pending·0 cites
- 0935US2016198568A1Printed circuit board and electronic component moduleSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →