Inventor · disambiguated record
Seiji Shirai
Also filed as: SHIRAI SEIJI
26 granted patents·1 pending application·998 citations·filing 1998–2015
98Inventor score
Top patents by PatentIndex Score
27 records- 0199US7307852B2Printed circuit board and method for manufacturing printed circuit boardIBIDEN CO LTD·Filed 2005·Granted Dec 11, 2007·82 cites·21 claims
- 0299US6876554B1Printing wiring board and method of producing the same and capacitor to be contained in printed wiring boardIBIDEN CO LTD·Filed 2000·Granted Apr 5, 2005·160 cites·4 claims
- 0399US6724638B1Printed wiring board and method of producing the sameIBIDEN CO LTD·Filed 2000·Granted Apr 20, 2004·249 cites·10 claims
- 0498US7978478B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Jul 12, 2011·46 cites·8 claims
- 0598US7622183B2Multilayer printed wiring board with filled viahole structureIBIDEN CO LTD·Filed 2006·Granted Nov 24, 2009·52 cites·38 claims
- 0697US7342803B2Printed circuit board and method of manufacturing printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Mar 11, 2008·92 cites·20 claims
- 0796US7855894B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Dec 21, 2010·26 cites·12 claims
- 0895US8830691B2Printed circuit board and method of manufacturing printed circuit boardINAGAKI YASUSHI·Filed 2010·Granted Sep 9, 2014·12 cites·28 claims
- 0995US7995352B2Printed circuit boardIBIDEN CO LTD·Filed 2010·Granted Aug 9, 2011·11 cites·18 claims
- 1095US7864542B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Jan 4, 2011·21 cites·14 claims
- 1192US8331102B2Printed circuit boardINAGAKI YASUSHI·Filed 2008·Granted Dec 11, 2012·14 cites·19 claims
- 1292US8116091B2Printed circuit boardINAGAKI YASUSHI·Filed 2010·Granted Feb 14, 2012·7 cites·22 claims
- 1392US7881069B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Feb 1, 2011·13 cites·14 claims
- 1492US7071424B1Multilayer printed wiring board having filled-via structureIBIDEN CO LTD·Filed 1999·Granted Jul 4, 2006·53 cites·30 claims
- 1592US6365843B1Multilayer printed wiring boardIBIDEN CO LTD·Filed 1998·Granted Apr 2, 2002·85 cites·21 claims
- 1690US8780573B2Printed circuit boardINAGAKI YASUSHI·Filed 2012·Granted Jul 15, 2014·6 cites·20 claims
- 1789US7864543B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Jan 4, 2011·9 cites·8 claims
- 1889US7737366B2Multilayer printed wiring board with filled viahole structureIBIDEN CO LTD·Filed 2008·Granted Jun 15, 2010·11 cites·7 claims
- 1988US8107253B2Printed circuit boardINAGAKI YASUSHI·Filed 2008·Granted Jan 31, 2012·9 cites·16 claims
- 2088US7390974B2Multilayer printed wiring board with filled viahole structureIBIDEN CO LTD·Filed 2004·Granted Jun 24, 2008·26 cites·15 claims
- 2181US8987603B2Multilayer printed wiring board with filled viahole structureSHIRAI SEIJI·Filed 2012·Granted Mar 24, 2015·3 cites·20 claims
- 2281US8763241B2Method of manufacturing printed wiring boardINAGAKI YASUSHI·Filed 2011·Granted Jul 1, 2014·2 cites·20 claims
- 2376US8115111B2Multilayer printed wiring board with filled viahole structureSHIRAI SEIJI·Filed 2009·Granted Feb 14, 2012·5 cites·13 claims
- 2475US8842440B2Printed circuit board and method of manufacturing printed circuit boardIBIDEN CO LTD·Filed 2013·Granted Sep 23, 2014·1 cites·22 claims
- 2574US8717772B2Printed circuit boardINAGAKI YASUSHI·Filed 2009·Granted May 6, 2014·2 cites·20 claims
- 2671US9060446B2Printed circuit boardIBIDEN CO LTD·Filed 2014·Granted Jun 16, 2015·1 cites·20 claims
- 2756US2015250056A1Printed circuit boardIBIDEN CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →