Inventor · disambiguated record
Seongmin Son
Also filed as: SON SEONGMIN
6 granted patents·2 pending applications·16 citations·filing 2012–2024
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0186US12136602B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 5, 2024·1 cites·16 claims
- 0282US9153559B2Semiconductor devices including through silicon via electrodes and methods of fabricating the sameLEE DOSUN·Filed 2012·Granted Oct 6, 2015·8 cites·19 claims
- 0380US11152317B2Semiconductor device including interconnection structure including copper and tin and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·17 claims
- 0479US2025022823A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0578US9847276B2Semiconductor devices having through-electrodes and methods for fabricating the sameKANG PIL-KYU·Filed 2014·Granted Dec 19, 2017·5 cites·14 claims
- 0656US2024274593A1Semiconductor device and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0750US11658139B2Semiconductor package for improving bonding reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 0848US11887841B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Seongmin Son files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →