Inventor · disambiguated record
Seng Kiong Teng
Also filed as: TENG SENG KIONG
5 granted patents·2 pending applications·41 citations·filing 2010–2014
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0191US8012799B1Method of assembling semiconductor device with heat spreaderFREESCALE SEMICONDUCTOR INC·Filed 2010·Granted Sep 6, 2011·39 cites·17 claims
- 0256US8933547B1Lead frame with power bar for semiconductor deviceYAP JIA LIN·Filed 2013·Granted Jan 13, 2015·2 cites·19 claims
- 0343US9177834B2Power bar design for lead frame-based packagesFOONG CHEE SENG·Filed 2014·Granted Nov 3, 2015·0 cites·8 claims
- 0440US2015118802A1Dual corner top gate moldingLOW BOON YEW·Filed 2014·Application pending·0 cites
- 0536US8987881B2Hybrid lead frame and ball grid array packageTENG SENG KIONG·Filed 2013·Granted Mar 24, 2015·0 cites·10 claims
- 0634US9129951B2Coated lead frame bond fingerTENG SENG KIONG·Filed 2013·Granted Sep 8, 2015·0 cites·6 claims
- 0731US2011204498A1Lead frame and semiconductor package manufactured therewithFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →