Inventor · disambiguated record
Sen Wu
Also filed as: WU SEN · WU SEN-CHAN
1 granted patent·1 pending application·0 citations·filing 2013–2017
2Inventor score
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2 records- 0130US11083091B2Hole connecting layer manufacturing method, circuit board manufacturing method and circuit boardGUANGZHOU FASTPRINT CIRCUIT TECH CO LTD·Filed 2017·Granted Aug 3, 2021·0 cites·8 claims
- 0212US2015124381A1Switchboard copper busbar heat dissipating deviceCHIA HSING ELECTRICAL CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →