Inventor · disambiguated record
Sentarou Yamamoto
Also filed as: YAMAMOTO SENTAROU
6 granted patents·16 pending applications·9 citations·filing 2006–2023
72Inventor score
Files withKYOCERA CORP22
Top patents by PatentIndex Score
22 records- 0194US11784459B2Electrical element mounting package, array package, and electrical deviceKYOCERA CORP·Filed 2021·Granted Oct 10, 2023·5 cites·13 claims
- 0270US7687137B2Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method thereforKYOCERA CORP·Filed 2006·Granted Mar 30, 2010·4 cites·8 claims
- 0359US12294134B2Antenna deviceKYOCERA CORP·Filed 2021·Granted May 6, 2025·0 cites·10 claims
- 0452US2025338399A1Circuit componentKYOCERA CORP·Filed 2023·Application pending·0 cites
- 0551US2025221079A1Wiring board and semiconductor deviceKYOCERA CORP·Filed 2023·Application pending·0 cites
- 0651US2025185162A1Wiring boardKYOCERA CORP·Filed 2023·Application pending·0 cites
- 0750US2022367759A1Light emitting element mounting package and light emitting deviceKYOCERA CORP·Filed 2020·Application pending·0 cites
- 0849US2009025855A1Insulating Substrate and Manufacturing Method Therefor, and Multilayer Wiring Board and Manufacturing Method ThereforKYOCERA CORP·Filed 2008·Application pending·0 cites
- 0949US2025142724A1Wiring boardKYOCERA CORP·Filed 2022·Application pending·0 cites
- 1048US11978998B2Substrate for mounting a light-emitting element, array substrate, and light-emitting deviceKYOCERA CORP·Filed 2019·Granted May 7, 2024·0 cites·7 claims
- 1148US2024389226A1Wiring boardKYOCERA CORP·Filed 2022·Application pending·0 cites
- 1247US12206057B2Joint body and light source deviceKYOCERA CORP·Filed 2020·Granted Jan 21, 2025·0 cites·14 claims
- 1346US12198992B2Electronic element housing package and electronic apparatusKYOCERA CORP·Filed 2020·Granted Jan 14, 2025·0 cites·7 claims
- 1446US2024224422A1Wiring boardKYOCERA CORP·Filed 2022·Application pending·0 cites
- 1545US2019214784A1Electrical element mounting package, array package, and electrical deviceKYOCERA CORP·Filed 2017·Application pending·0 cites
- 1644US2023282791A1Wiring board, light emitting element mounting-use package, and light emitting deviceKYOCERA CORP·Filed 2021·Application pending·0 cites
- 1740US2024047847A1Antenna deviceKYOCERA CORP·Filed 2021·Application pending·0 cites
- 1840US2024047894A1Antenna deviceKYOCERA CORP·Filed 2021·Application pending·0 cites
- 1938US2007218259A1Laminate, method for manufacturing the laminate and method for manufacturing wiring boardKYOCERA CORP·Filed 2007·Application pending·0 cites
- 2038US2022037250A1Wiring board and electric deviceKYOCERA CORP·Filed 2019·Application pending·0 cites
- 2134US2023160560A1Substrate support body, substrate support structure, light emitting device, and lighting fixtureKYOCERA CORP·Filed 2021·Application pending·0 cites
- 2229US2022328718A1Light emitting element mounting package and light emitting deviceKYOCERA CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →