Inventor · disambiguated record
Se Young Yang
Also filed as: YANG SE YOUNG
20 granted patents·9 pending applications·479 citations·filing 2006–2024
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8INVENSAS CORP6APPLE INC5CHAU ELLIS3ADEIA SEMICONDUCTOR TECH LLC2
Top patents by PatentIndex Score
29 records- 0198US9633974B2System in package fan out stacking architecture and process flowAPPLE INC·Filed 2015·Granted Apr 25, 2017·57 cites·16 claims
- 0298US9105483B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Aug 11, 2015·60 cites·29 claims
- 0398US9041227B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted May 26, 2015·37 cites·16 claims
- 0498US8836136B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Sep 16, 2014·84 cites·29 claims
- 0598US8404520B1Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Mar 26, 2013·112 cites·27 claims
- 0697US9659907B2Double side mounting memory integration in thin low warpage fanout packageAPPLE INC·Filed 2015·Granted May 23, 2017·26 cites·20 claims
- 0794US8978247B2TSV fabrication using a removable handling structureYANG SE YOUNG·Filed 2012·Granted Mar 17, 2015·54 cites·23 claims
- 0892US2025118705A1Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 0990US10181455B23D thin profile pre-stacking architecture using reconstitution methodAPPLE INC·Filed 2017·Granted Jan 15, 2019·6 cites·19 claims
- 1089US9761558B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2015·Granted Sep 12, 2017·4 cites·16 claims
- 1188US7692314B2Wafer level chip scale package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 6, 2010·20 cites·7 claims
- 1285US12211821B2Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 1383US9236355B2EMI shielded wafer level fan-out pop packageAPPLE INC·Filed 2014·Granted Jan 12, 2016·7 cites·17 claims
- 1478US11735563B2Package-on-package assembly with wire bond viasINVENSAS LLC·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 1578US9252122B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted Feb 2, 2016·2 cites·15 claims
- 1675US11189595B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 1774US7777308B2Integrated circuit packages including sinuous lead framesSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 17, 2010·6 cites·20 claims
- 1867US7884487B2Rotation joint and semiconductor device having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 8, 2011·3 cites·17 claims
- 1964US9601398B2Thin wafer handling and known good die test methodINVENSAS CORP·Filed 2014·Granted Mar 21, 2017·1 cites·15 claims
- 2062US10756049B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2017·Granted Aug 25, 2020·0 cites·16 claims
- 2149US8846447B2Thin wafer handling and known good die test methodWOYCHIK CHARLES G·Filed 2012·Granted Sep 30, 2014·0 cites·35 claims
- 2247US2010081236A1Method of manufacturing semiconductor device with embedded interposerSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2345US2015364454A1Reconfigured wide i/o memory modules and package architectures using sameAPPLE INC·Filed 2014·Application pending·0 cites
- 2444US2008093725A1Semiconductor package preventing warping and wire severing defects, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2544US2007155055A1Method of dicing wafer and dieSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2643US2008087995A1Flexible film semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2743US2008290513A1Semiconductor package having molded balls and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2839US2009146300A1Semiconductor packages and electronic products employing the sameYANG SE-YOUNG·Filed 2008·Application pending·0 cites
- 2938US2007029674A1Board-on-chip package and stack package using the sameSHIN DONG-KIL·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Se Young Yang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →