Inventor · disambiguated record
Seng Kim Ye
Also filed as: YE SENG KIM · YE SENG KIM DALSON
51 granted patents·33 pending applications·301 citations·filing 2005–2025
98Inventor score
Top patents by PatentIndex Score
84 records- 0198US7504284B2Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 17, 2009·85 cites·35 claims
- 0297US11282811B2Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layerMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 22, 2022·5 cites·20 claims
- 0397US7557443B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 7, 2009·66 cites·42 claims
- 0493US12237301B2Through stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 25, 2025·2 cites·20 claims
- 0593US8823159B2Stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 2, 2014·12 cites·19 claims
- 0692US9761562B2Semiconductor device packages including a controller elementMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 12, 2017·7 cites·16 claims
- 0791US9418974B2Stacked semiconductor die assemblies with support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·9 cites·18 claims
- 0891US8519523B2Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devicesYE SENG KIM DALSON·Filed 2011·Granted Aug 27, 2013·10 cites·24 claims
- 0990US9640458B2Stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted May 2, 2017·7 cites·14 claims
- 1090US8030748B2Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2009·Granted Oct 4, 2011·12 cites·13 claims
- 1189US9627367B2Memory devices with controllers under memory packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 18, 2017·7 cites·29 claims
- 1289US9406660B2Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 2, 2016·7 cites·14 claims
- 1388US11929351B2Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layerMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 12, 2024·1 cites·20 claims
- 1488US9985000B2Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted May 29, 2018·4 cites·13 claims
- 1587US12148736B2Three-dimensional bonding scheme and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 19, 2024·1 cites·20 claims
- 1687US8923004B2Microelectronic packages with small footprints and associated methods of manufacturingLOW PENG WANG·Filed 2008·Granted Dec 30, 2014·43 cites·6 claims
- 1784US11527459B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 13, 2022·1 cites·9 claims
- 1884US8507318B2Method for manufacturing microelectronic devicesYE SENG KIM DALSON·Filed 2009·Granted Aug 13, 2013·9 cites·21 claims
- 1983US2024274583A1Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2082US2024128254A1Stacked semiconductor die assemblies with support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2181US10727206B2Memory devices with controllers under memory packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 28, 2020·2 cites·24 claims
- 2280US12243807B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 2380US10504881B2Stacked semiconductor die assemblies with support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 10, 2019·2 cites·13 claims
- 2480US10128217B2Memory devices with controllers under memory packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 13, 2018·2 cites·25 claims
- 2580US10014281B2Methods of manufacturing a semiconductor device package including a controller elementMICRON TECHNOLOGY INC·Filed 2017·Granted Jul 3, 2018·2 cites·20 claims
- 2679US12293992B2Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2023·Granted May 6, 2025·0 cites·19 claims
- 2778US2025259972A1Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2877US2025349656A1Apparatus including direct-contact heat paths and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2976US11894289B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 3076US11101262B2Stacked semiconductor die assemblies with support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 24, 2021·1 cites·20 claims
- 3176US10658336B2Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted May 19, 2020·1 cites·10 claims
- 3276US2025336796A1Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3375US11824044B2Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
- 3475US10304808B2Semiconductor devices including a controller and methods of forming such devicesMICRON TECHNOLOGY INC·Filed 2018·Granted May 28, 2019·1 cites·20 claims
- 3575US2025079405A1Three-dimensional bonding scheme and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3674US11855065B2Stacked semiconductor die assemblies with support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 3774US10431513B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 1, 2019·1 cites·14 claims
- 3874US2025309194A1Cross stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3973US9583476B2Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2016·Granted Feb 28, 2017·1 cites·16 claims
- 4072US11101244B2Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 24, 2021·0 cites·12 claims
- 4170US12432859B2Surface mount device bonded to an inner layer of a multi-layer substrateMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 30, 2025·0 cites·17 claims
- 4270US11658154B2Memory devices with controllers under memory packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·23 claims
- 4369US11710722B2Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 4469US2024203963A1Systems and methods for reducing the size of a semiconductor assemblyMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4568US12431418B2Three dimensional semiconductor trace length matching and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 30, 2025·0 cites·19 claims
- 4668US12412811B2Split via structure for semiconductor device packagingMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 9, 2025·0 cites·18 claims
- 4767US12354939B2Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 8, 2025·0 cites·15 claims
- 4866US12362319B2Cross stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 4966US2025192102A1Through stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 5065US10861824B2Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 8, 2020·0 cites·13 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →