Inventor · disambiguated record
Se-Ho You
Also filed as: YOU SE-HO
15 granted patents·2 pending applications·63 citations·filing 2007–2023
90Inventor score
Top patents by PatentIndex Score
17 records- 0196US8872319B2Stacked package structure including insulating layer between two stacked packagesKIM YONG-HOON·Filed 2011·Granted Oct 28, 2014·32 cites·38 claims
- 0290US11626373B2Semiconductor packages including antenna patternSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·2 cites·20 claims
- 0387US9520387B2Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layerSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 13, 2016·8 cites·14 claims
- 0486US11380635B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 5, 2022·2 cites·20 claims
- 0586US9147643B2Semiconductor packageYOU SE-HO·Filed 2014·Granted Sep 29, 2015·10 cites·18 claims
- 0679US11482509B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·1 cites·20 claims
- 0776US9171827B2Stack type semiconductor packageLEE JIN-HO·Filed 2014·Granted Oct 27, 2015·3 cites·15 claims
- 0873US12261135B2Semiconductor packages including antenna patternSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0973US10032706B2Package substratesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 24, 2018·2 cites·13 claims
- 1070US9030838B2Package substrate and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 12, 2015·2 cites·13 claims
- 1162US11855013B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·16 claims
- 1260US12374610B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1360US8649186B2Package substrate and semiconductor package having the sameYOU SE-HO·Filed 2010·Granted Feb 11, 2014·1 cites·4 claims
- 1453US10256181B2Package substratesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 9, 2019·0 cites·20 claims
- 1549US2024213166A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1648US2008099885A1Semiconductor package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1743US8084359B2Semiconductor package and methods of manufacturing the sameYOU SE-HO·Filed 2010·Granted Dec 27, 2011·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →