Inventor · disambiguated record
Seulgi Yu
Also filed as: YU SEULGI
0 granted patents·6 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0155US2025300058A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0254US2025259921A1Package substrate and semiconductor package including the package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0354US2025201776A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0454US2025226331A1Bridge chip, semiconductor package including bridge chip and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0552US2025193997A1Multilayer wiring substrate and semiconductor package including the multilayer wiring substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0651US2025239575A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →