Inventor · disambiguated record
Sergey Yuferev
Also filed as: YUFEREV SERGEY
10 granted patents·5 pending applications·0 citations·filing 2019–2025
77Inventor score
Top patents by PatentIndex Score
15 records- 0178US2025087581A1Method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0274US12159829B2Semiconductor package with non-uniformly distributed viasINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Dec 3, 2024·0 cites·23 claims
- 0374US12009290B2Semiconductor module having a multi-branch switch node connectorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 0468US11664304B2Semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted May 30, 2023·0 cites·19 claims
- 0562US11978692B2Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted May 7, 2024·0 cites·12 claims
- 0660US11444017B2Semiconductor package and method of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Sep 13, 2022·0 cites·10 claims
- 0759US11348861B2Semiconductor package and method of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 0855US11935874B2Circuitry and method of forming a circuitryINFINEON TECHNOLOGIES AG·Filed 2021·Granted Mar 19, 2024·0 cites·12 claims
- 0954US12094807B2Stacked transistor chip package with source couplingINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 17, 2024·0 cites·16 claims
- 1053US2024313105A1Semiconductor die with a vertical deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1152US10811342B2Semiconductor package and method of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Oct 20, 2020·0 cites·20 claims
- 1252US2023420393A1Semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1352US2024030111A1Semiconductor package and method for fabricating a semiconductor package for upright mountingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1448US11973071B2Semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Apr 30, 2024·0 cites·17 claims
- 1546US2025266334A1Vertical gan deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →