Inventor · disambiguated record
Shinya Akizuki
Also filed as: AKIZUKI SHINYA
8 granted patents·8 pending applications·124 citations·filing 1989–2013
87Inventor score
Top patents by PatentIndex Score
16 records- 0174US5264552AOrganic polymer, conducting organic polymer, production methods and uses of the sameNITTO DENKO CORP·Filed 1989·Granted Nov 23, 1993·31 cites·9 claims
- 0263US5728321AOrganic polymer, conducting organic polymer, production methods and uses of the sameNITTO DENKO CORP·Filed 1995·Granted Mar 17, 1998·25 cites·4 claims
- 0361US5565709ASemiconductor deviceNITTO DENKO CORP·Filed 1995·Granted Oct 15, 1996·27 cites·5 claims
- 0458US5302673APoly-hydroxynaphthalene compounds and epoxy resin compositionDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1992·Granted Apr 12, 1994·11 cites·2 claims
- 0553US7265167B2Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the sameNITTO DENKO CORP·Filed 2003·Granted Sep 4, 2007·2 cites·7 claims
- 0650US5976916AMethod of producing semiconductor device and encapsulating pellet employed thereinNITTO DENKO CORP·Filed 1996·Granted Nov 2, 1999·18 cites·10 claims
- 0740US2013157419A1Method of manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 0840US2014004637A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0940US2014004635A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1040US2014004636A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1140US2014000793A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1240US2014004683A1Method of manufacturing semiconductor elementNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1338US5334674APolyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositionsDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1992·Granted Aug 2, 1994·10 cites·9 claims
- 1437US7268191B2Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained therebyNITTO DENKO CORP·Filed 2004·Granted Sep 11, 2007·0 cites·2 claims
- 1535US2012115281A1Method of manufacturing semiconductor deviceIWASHIGE TOMOHITO·Filed 2011·Application pending·0 cites
- 1633US2010308477A1Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameNITTO DENKO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →