Inventor · disambiguated record
Shinya Arakawa
Also filed as: ARAKAWA SHINYA
1 granted patent·1 pending application·0 citations·filing 2016–2019
13Inventor score
Technology areasH10W
Files withPANASONIC IP MAN CO LTD2
Top patents by PatentIndex Score
2 records- 0151US12021015B2Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 25, 2024·0 cites·7 claims
- 0240US2016293538A1Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →