Inventor · disambiguated record
Shintaro Araki
Also filed as: ARAKI SHINTARO
13 granted patents·6 pending applications·6 citations·filing 2011–2024
83Inventor score
Top patents by PatentIndex Score
19 records- 0165US11318529B2Casting deviceHONDA FOUNDRY CO LTD·Filed 2019·Granted May 3, 2022·0 cites·8 claims
- 0263US10096566B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Oct 9, 2018·1 cites·10 claims
- 0361US9467086B2Vehicle-mounted motor driving control boardSAITO SHOJI·Filed 2012·Granted Oct 11, 2016·2 cites·5 claims
- 0460US12500135B2Semiconductor device comprising semiconductor element; insulating component; lead electrode; and first bonding material, second bonding material, third bonding material, and fourth bonding material made of a same materialMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Dec 16, 2025·0 cites·22 claims
- 0558US10049960B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Aug 14, 2018·1 cites·17 claims
- 0657US9484927B2Semiconductor device and automobileAIKO MITSUNORI·Filed 2012·Granted Nov 1, 2016·2 cites·8 claims
- 0757US2024178100A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0857US2025112134A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0953US10529682B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 7, 2020·0 cites·4 claims
- 1049US2025183783A1Inverter and electric-driven vehicleMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1148US2024162196A1Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1247US2024063073A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1346US11212908B2Semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Dec 28, 2021·0 cites·20 claims
- 1445US12341078B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jun 24, 2025·0 cites·17 claims
- 1545US11621213B2Semiconductor device including a spring plateMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Apr 4, 2023·0 cites·21 claims
- 1645US2023012134A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1742US10224267B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Mar 5, 2019·0 cites·6 claims
- 1840US9472538B2Semiconductor device manufacturing method and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Oct 18, 2016·0 cites·30 claims
- 1932US8749047B2Power moduleARAKI SHINTARO·Filed 2011·Granted Jun 10, 2014·0 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Shintaro Araki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →