Inventor · disambiguated record
Shinichi Araya
Also filed as: ARAYA SHINICHI
14 granted patents·1 pending application·570 citations·filing 1986–2002
95Inventor score
Top patents by PatentIndex Score
15 records- 0192US5084962AApparatus for and method of automatically mounting electronic component on printed circuit boardTDK CORP·Filed 1989·Granted Feb 4, 1992·67 cites·23 claims
- 0289US5878484AChip-type circuit element mounting apparatusTDK CORP·Filed 1995·Granted Mar 9, 1999·68 cites·26 claims
- 0384US4805110ACircuit element mounting system and methodTDK CORP·Filed 1986·Granted Feb 14, 1989·43 cites·11 claims
- 0483US6333932B1Connectionless communications system, its test method, and intra-station control systemFUJITSU LTD·Filed 1995·Granted Dec 25, 2001·143 cites·13 claims
- 0580US6435808B1Chip-type circuit element mounting apparatusTDK CORP·Filed 2000·Granted Aug 20, 2002·29 cites·10 claims
- 0672US6098539AApparatus for screen position correcting in screen printingTDK CORP·Filed 1998·Granted Aug 8, 2000·14 cites·8 claims
- 0770US5319846AElectronic component feed systemTDK CORP·Filed 1992·Granted Jun 14, 1994·33 cites·34 claims
- 0866US5956339AApparatus for selecting a route in a packet-switched communications networkFUJITSU LTD·Filed 1997·Granted Sep 21, 1999·63 cites·14 claims
- 0964US5549716AProcess for manufacturing integrated circuits using an automated multi-station apparatus including an adhesive dispenser and apparatus thereforTDK CORP·Filed 1993·Granted Aug 27, 1996·35 cites·7 claims
- 1055US6205925B1Method for screen position correcting in screen printingTDK CORP·Filed 1999·Granted Mar 27, 2001·7 cites·11 claims
- 1153US7551612B2Intra-station control system for connectionless communications systemFUJITSU LTD·Filed 1999·Granted Jun 23, 2009·30 cites·2 claims
- 1249US6152679AChip-type circuit element mounting apparatusTDK CORP·Filed 1999·Granted Nov 28, 2000·12 cites·4 claims
- 1349US5368193AElectronic component packaging means, and supply mechanism for and method of supplying electronic components by using the electronic component packaging meansTDK CORP·Filed 1992·Granted Nov 29, 1994·14 cites·64 claims
- 1438US2004126206A1Mini-environment system and operating method thereofTDK CORP·Filed 2002·Application pending·0 cites
- 1533US5978380AApparatus for establishing common signal channelFUJITSU LTD·Filed 1997·Granted Nov 2, 1999·12 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →