Inventor · disambiguated record
Shams U. Arifeen
Also filed as: ARIFEEN SHAMS U
26 granted patents·5 pending applications·30 citations·filing 2017–2024
93Inventor score
Files withMICRON TECHNOLOGY INC31
Top patents by PatentIndex Score
31 records- 0197US11011449B1Apparatus and method for dissipating heat in multiple semiconductor device modulesMICRON TECHNOLOGY INC·Filed 2020·Granted May 18, 2021·8 cites·22 claims
- 0296US11164837B1Semiconductor device packages with angled pillars for decreasing stressMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 2, 2021·5 cites·20 claims
- 0393US11984440B2Semiconductor devices, semiconductor device packages, electronic systems including same, and related methodsMICRON TECHNOLOGY INC·Filed 2021·Granted May 14, 2024·2 cites·16 claims
- 0493US11276659B2Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elementsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 15, 2022·4 cites·15 claims
- 0590US11444037B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 13, 2022·2 cites·22 claims
- 0685US10784212B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 22, 2020·3 cites·22 claims
- 0783US11239133B2Apparatus and method for dissipating heat in multiple semiconductor device modulesMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 1, 2022·1 cites·20 claims
- 0883US10811365B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 20, 2020·3 cites·18 claims
- 0978US11587918B2Semiconductor devices, semiconductor device packages, electronic systems including same, and related methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 21, 2023·2 cites·16 claims
- 1076US11848282B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 19, 2023·0 cites·22 claims
- 1174US12211814B2Semiconductor interconnect structures with conductive elements, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·21 claims
- 1273US12211822B2Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 1373US2025079371A1Semiconductor die assemblies with flexible interconnects and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1472US12218079B2Semiconductor devices with reinforced substratesMICRON TECHNOLOGY INC·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 1569US11869862B2Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 9, 2024·0 cites·17 claims
- 1667US11552029B2Semiconductor devices with reinforced substratesMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 10, 2023·0 cites·11 claims
- 1765US11728307B2Semiconductor interconnect structures with conductive elements, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 15, 2023·0 cites·21 claims
- 1865US11664360B2Circuit board with spaces for embedding componentsMICRON TECHNOLOGY INC·Filed 2021·Granted May 30, 2023·0 cites·11 claims
- 1965US11616028B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 28, 2023·0 cites·19 claims
- 2064US11855002B2Warpage control in microelectronic packages, and related assemblies and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2164US11688658B2Semiconductor deviceMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 2262US11721658B2Semiconductor device packages with angled pillars for decreasing stressMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 2361US11769752B2Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 26, 2023·0 cites·20 claims
- 2461US2023260943A1Semiconductor die assemblies with flexible interconnects and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2557US11031353B2Warpage control in microelectronic packages, and related assemblies and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 8, 2021·0 cites·26 claims
- 2656US2022085002A1Circuit board with spaces for embedding componentsMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 2754US12341110B2Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 24, 2025·0 cites·14 claims
- 2847US11646286B2Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder jointsMICRON TECHNOLOGY INC·Filed 2019·Granted May 9, 2023·0 cites·10 claims
- 2946US2019067145A1Semiconductor deviceMICRON TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 3044US11997782B2Thermally conductive label for circuitMICRON TECHNOLOGY INC·Filed 2021·Granted May 28, 2024·0 cites·17 claims
- 3144US2022037258A1Semiconductor devices with thermal buffer structuresMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →