Inventor · disambiguated record
Shuji Asai
Also filed as: ASAI SHUJI
11 granted patents·152 citations·filing 1978–2008
90Inventor score
Top patents by PatentIndex Score
11 records- 0191US7834461B2Semiconductor apparatusNEC ELECTRONICS CORP·Filed 2007·Granted Nov 16, 2010·32 cites·14 claims
- 0276US7851884B2Field-effect transistor, semiconductor chip and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Dec 14, 2010·10 cites·26 claims
- 0371US6159861AMethod of manufacturing semiconductor deviceNEC CORP·Filed 1998·Granted Dec 12, 2000·33 cites·29 claims
- 0470US5514605AFabrication process for compound semiconductor deviceNEC CORP·Filed 1995·Granted May 7, 1996·38 cites·5 claims
- 0567US6462419B1Semiconductor device and method for manufacturing the sameNEC CORP·Filed 2000·Granted Oct 8, 2002·16 cites·8 claims
- 0635US6420775B1Compound semiconductor device having an ion implanted defect-rich layer for improved backgate effect suppressionNEC CORP·Filed 1997·Granted Jul 16, 2002·6 cites·7 claims
- 0734US6069375AField effect transistorNEC CORP·Filed 1997·Granted May 30, 2000·4 cites·3 claims
- 0834US5549749ASubstrate with a compound semiconductor surface layer and method for preparing the sameNEC CORP·Filed 1995·Granted Aug 27, 1996·4 cites·12 claims
- 0934US5548136ASubstrate with a compound semiconductor surface layer and method for preparing the sameNEC CORP·Filed 1994·Granted Aug 20, 1996·6 cites·8 claims
- 1032US6150245AMethod of manufacturing a field effect transistorNEC CORP·Filed 1999·Granted Nov 21, 2000·3 cites·2 claims
- 1129US4221855AElectrophotographic plate produced by firing glass binder containing inorganic photoconductor and high melting point inorganic additive in non-reducing atmosphereNIPPON ELECTRIC CO·Filed 1978·Granted Sep 9, 1980·0 cites·7 claims
Join the waitlist — get patent alerts
Get an alert when Shuji Asai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →