Inventor · disambiguated record
Shintaro Asuke
Also filed as: ASUKE SHINTARO
15 granted patents·3 pending applications·200 citations·filing 1994–2012
92Inventor score
Top patents by PatentIndex Score
18 records- 0197US8211259B2Separating method of bonded bodySATO MITSURU·Filed 2008·Granted Jul 3, 2012·45 cites·12 claims
- 0292US7353623B2Solvent removal apparatus and methodSEIKO EPSON CORP·Filed 2005·Granted Apr 8, 2008·23 cites·22 claims
- 0391US6899787B2Plasma processing apparatus and plasma processing system with reduced feeding loss, and method for stabilizing the apparatus and systemSEIKO EPSON CORP·Filed 2002·Granted May 31, 2005·40 cites·19 claims
- 0480US7516549B2Nozzle plate producing methodSEIKO EPSON CORP·Filed 2006·Granted Apr 14, 2009·6 cites·8 claims
- 0575US8101044B2Method of manufacturing bonded body and bonded bodyASUKE SHINTARO·Filed 2009·Granted Jan 24, 2012·2 cites·21 claims
- 0674US7267426B2Liquid-repellent film-coated member, constitutive member of liquid-jet device, nozzle plate of liquid-jet head, liquid-jet head, and liquid-jet deviceSEIKO EPSON CORP·Filed 2004·Granted Sep 11, 2007·15 cites·18 claims
- 0774US7098121B2Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing deviceSEIKO EPSON CORP·Filed 2003·Granted Aug 29, 2006·16 cites·32 claims
- 0870US7305868B2Method and system for evaluating lyophobicity of inner wall of fine tube including lyophobic filmSEIKO EPSON CORP·Filed 2005·Granted Dec 11, 2007·2 cites·14 claims
- 0969US6342275B1Method and apparatus for atmospheric pressure plasma surface treatment, method of manufacturing semiconductor device, and method of manufacturing ink jet printing headSEIKO EPSON CORP·Filed 1994·Granted Jan 29, 2002·41 cites·3 claims
- 1068US8486218B2Method of manufacturing a part of a MEMS systemASUKE SHINTARO·Filed 2012·Granted Jul 16, 2013·2 cites·21 claims
- 1164US8617340B2Bonding method and bonded bodyYAMAMOTO TAKATOSHI·Filed 2008·Granted Dec 31, 2013·0 cites·13 claims
- 1263US7148148B2Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same methodSEIKO EPSON CORP·Filed 2002·Granted Dec 12, 2006·8 cites·23 claims
- 1361US8679283B2Bonding method and bonded bodyYAMAMOTO TAKATOSHI·Filed 2012·Granted Mar 25, 2014·0 cites·16 claims
- 1460US2012094132A1Method of Manufacturing a Part of a MEMS SystemASUKE SHINTARO·Filed 2011·Application pending·0 cites
- 1548US8243249B2Method of manufacturing liquid crystal deviceASUKE SHINTARO·Filed 2009·Granted Aug 14, 2012·0 cites·6 claims
- 1639US7641943B2Coating method, liquid supplying head and liquid supplying apparatusSEIKO EPSON CORP·Filed 2005·Granted Jan 5, 2010·0 cites·14 claims
- 1739US2004221616A1Continuous-treatment apparatus and continuous-treatment methodFiled 2004·Application pending·0 cites
- 1836US2004209190A1Pattern forming method and apparatus used for semiconductor device, electric circuit, display module, and light emitting deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →