Inventor · disambiguated record
Sheldon H. Butt
Also filed as: BUTT SHELDON H
50 granted patents·2,513 citations·filing 1974–1989
99Inventor score
Top patents by PatentIndex Score
50 records- 0195US5014159ASemiconductor packageOLIN CORP·Filed 1989·Granted May 7, 1991·137 cites·10 claims
- 0295US4888449ASemiconductor packageOLIN CORP·Filed 1988·Granted Dec 19, 1989·152 cites·47 claims
- 0394US4866571ASemiconductor packageOLIN CORP·Filed 1984·Granted Sep 12, 1989·92 cites·21 claims
- 0494US4491622AComposites of glass-ceramic to metal seals and method of making the sameOLIN CORP·Filed 1982·Granted Jan 1, 1985·73 cites·18 claims
- 0593US4897508AMetal electronic packageOLIN CORP·Filed 1988·Granted Jan 30, 1990·121 cites·36 claims
- 0693US4882212AElectronic packaging of components incorporating a ceramic-glass-metal compositeOLIN CORP·Filed 1986·Granted Nov 21, 1989·114 cites·29 claims
- 0792US4769345AProcess for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vaporOLIN CORP·Filed 1987·Granted Sep 6, 1988·107 cites·25 claims
- 0892US4410927ACasing for an electrical component having improved strength and heat transfer characteristicsOLIN CORP·Filed 1982·Granted Oct 18, 1983·83 cites·10 claims
- 0991US4607276ATape packagesOLIN CORP·Filed 1984·Granted Aug 19, 1986·75 cites·20 claims
- 1090US4967260AHermetic microminiature packagesINT ELECTRONIC RES CORP·Filed 1988·Granted Oct 30, 1990·88 cites·32 claims
- 1189US4849857AHeat dissipating interconnect tape for use in tape automated bondingOLIN CORP·Filed 1987·Granted Jul 18, 1989·95 cites·34 claims
- 1289US4524238ASemiconductor packagesOLIN CORP·Filed 1982·Granted Jun 18, 1985·69 cites·32 claims
- 1389US4480262ASemiconductor casingOLIN CORP·Filed 1982·Granted Oct 30, 1984·69 cites·7 claims
- 1488US4656499AHermetically sealed semiconductor casingOLIN CORP·Filed 1984·Granted Apr 7, 1987·68 cites·6 claims
- 1587US4461924ASemiconductor casingOLIN CORP·Filed 1982·Granted Jul 24, 1984·61 cites·14 claims
- 1686US4594770AMethod of making semiconductor casingOLIN CORP·Filed 1984·Granted Jun 17, 1986·59 cites·7 claims
- 1785US4839716ASemiconductor packagingOLIN CORP·Filed 1987·Granted Jun 13, 1989·69 cites·22 claims
- 1885US4761518ACeramic-glass-metal packaging for electronic components incorporating unique leadframe designsOLIN CORP·Filed 1987·Granted Aug 2, 1988·85 cites·27 claims
- 1985US4542259AHigh density packagesOLIN CORP·Filed 1984·Granted Sep 17, 1985·57 cites·47 claims
- 2083US4961106AMetal packages having improved thermal dissipationOLIN CORP·Filed 1987·Granted Oct 2, 1990·59 cites·40 claims
- 2183US4577056AHermetically sealed metal packageOLIN CORP·Filed 1984·Granted Mar 18, 1986·53 cites·31 claims
- 2282US4569692ALow thermal expansivity and high thermal conductivity substrateOLIN CORP·Filed 1983·Granted Feb 11, 1986·46 cites·24 claims
- 2381US5001546AClad metal lead frame substratesOLIN CORP·Filed 1983·Granted Mar 19, 1991·46 cites·24 claims
- 2481US4784974AMethod of making a hermetically sealed semiconductor casingOLIN CORP·Filed 1986·Granted Nov 15, 1988·58 cites·7 claims
- 2579US3944504ACatalyst for the diminution of automobile exhaust gasesOLIN CORP·Filed 1975·Granted Mar 16, 1976·32 cites·12 claims
- 2677US5024883AElectronic packaging of components incorporating a ceramic-glass-metal compositeOLIN CORP·Filed 1989·Granted Jun 18, 1991·47 cites·22 claims
- 2776US4851615APrinted circuit boardOLIN CORP·Filed 1984·Granted Jul 25, 1989·29 cites·20 claims
- 2875US4805009AHermetically sealed semiconductor packageOLIN CORP·Filed 1985·Granted Feb 14, 1989·48 cites·59 claims
- 2975US4521469ACasing for electronic componentsOLIN CORP·Filed 1984·Granted Jun 4, 1985·37 cites·5 claims
- 3069US4532222AReinforced glass compositesOLIN CORP·Filed 1983·Granted Jul 30, 1985·27 cites·19 claims
- 3168US4736236ATape bonding material and structure for electronic circuit fabricationOLIN CORP·Filed 1986·Granted Apr 5, 1988·34 cites·17 claims
- 3267US4525422AAdhesion primers for encapsulating epoxiesOLIN CORP·Filed 1982·Granted Jun 25, 1985·28 cites·6 claims
- 3366US4767049ASpecial surfaces for wire bondingOLIN CORP·Filed 1986·Granted Aug 30, 1988·31 cites·5 claims
- 3465US4652323APlasma deposition applications for communication cablesOLIN CORP·Filed 1984·Granted Mar 24, 1987·18 cites·17 claims
- 3564US4682414AMulti-layer circuitryOLIN CORP·Filed 1985·Granted Jul 28, 1987·31 cites·12 claims
- 3664US4570337AMethod of assembling a chip carrierOLIN CORP·Filed 1984·Granted Feb 18, 1986·24 cites·6 claims
- 3763US4796083ASemiconductor casingOLIN CORP·Filed 1987·Granted Jan 3, 1989·27 cites·10 claims
- 3861US4582556AAdhesion primers for encapsulating epoxiesOLIN CORP·Filed 1984·Granted Apr 15, 1986·22 cites·9 claims
- 3959USD265584SThree tube heat exchanger panelOLIN CORP·Filed 1980·Granted Jul 27, 1982·7 cites·1 claims
- 4058US4862323AChip carrierOLIN CORP·Filed 1985·Granted Aug 29, 1989·23 cites·14 claims
- 4155US4827377AMulti-layer circuitryOLIN CORP·Filed 1982·Granted May 2, 1989·17 cites·15 claims
- 4255US4659404AMethod of making low thermal expansivity and high thermal conductivity substrateOLIN CORP·Filed 1985·Granted Apr 21, 1987·19 cites·23 claims
- 4352US3931049AMethod for producing a catalystOLIN CORP·Filed 1974·Granted Jan 6, 1976·5 cites·9 claims
- 4451US4882236ARigid magnetic recording disks and method of producing sameOLIN CORP·Filed 1988·Granted Nov 21, 1989·12 cites·6 claims
- 4548US4099559ASolar absorber plate designOLIN CORP·Filed 1976·Granted Jul 11, 1978·14 cites·18 claims
- 4643US4889960ASealed semiconductor casingOLIN CORP·Filed 1985·Granted Dec 26, 1989·11 cites·6 claims
- 4740US4853491AChip carrierOLIN CORP·Filed 1985·Granted Aug 1, 1989·9 cites·9 claims
- 4838US4275784AFail safe heat exchangerOLIN CORP·Filed 1980·Granted Jun 30, 1981·7 cites·7 claims
- 4935US4246960AFail safe heat exchangerOLIN CORP·Filed 1979·Granted Jan 27, 1981·5 cites·11 claims
- 5034US4883778AProducts formed of a ceramic-glass-metal compositeOLIN CORP·Filed 1986·Granted Nov 28, 1989·13 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →