Inventor · disambiguated record
Shujie Cai
Also filed as: CAI SHUJIE
3 granted patents·2 pending applications·4 citations·filing 2017–2019
53Inventor score
Files withHUAWEI TECH CO LTD5
Top patents by PatentIndex Score
5 records- 0179US10784181B2Apparatus and manufacturing methodHUAWEI TECH CO LTD·Filed 2018·Granted Sep 22, 2020·4 cites·19 claims
- 0242US10903135B2Chip package structure and manufacturing method thereofHUAWEI TECH CO LTD·Filed 2017·Granted Jan 26, 2021·0 cites·16 claims
- 0342US2020135615A1Chip package structureHUAWEI TECH CO LTD·Filed 2019·Application pending·0 cites
- 0435US10607913B2Integrated circuit die and manufacture method thereofHUAWEI TECH CO LTD·Filed 2017·Granted Mar 31, 2020·0 cites·13 claims
- 0534US2018247880A1Chip Packaging SystemHUAWEI TECH CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →