Inventor · disambiguated record
Sheng-Chin Chan
Also filed as: CHAN SHENG-CHIN
1 granted patent·3 pending applications·1 citations·filing 2015–2019
14Inventor score
Top patents by PatentIndex Score
4 records- 0150US9593887B2Heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layersTAI-SOL ELECTRONICS CO LTD·Filed 2015·Granted Mar 14, 2017·1 cites·6 claims
- 0241US2021033356A1Heat dissipating apparatus used in non-forced convectionTAISOL ELECTRONICS CO LTD GROUP·Filed 2019·Application pending·0 cites
- 0331US2016209121A1Heat-dissipating structureTAI SOL ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 0429US2016219755A1Thermoelectric-cooling-chip-based heat-disspating systemTAI-SOL ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →