Inventor · disambiguated record
Shih-Kai Chan
Also filed as: CHAN SHIH-KAI
4 granted patents·4 pending applications·4 citations·filing 2020–2023
66Inventor score
Top patents by PatentIndex Score
8 records- 0196US11417799B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0286US2024072203A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2023·Application pending·0 cites
- 0385US2024063339A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSAMILEDS CORP·Filed 2023·Application pending·0 cites
- 0481US11862755B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·5 claims
- 0580US11862754B2Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·4 claims
- 0672US12426410B2Semiconductor components and semiconductor structures and methods of fabricationTSLC CORP·Filed 2020·Granted Sep 23, 2025·0 cites·22 claims
- 0755US2022320366A1Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth SubstrateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 0853US2023018855A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →