Inventor · disambiguated record
Shih-Tzung Chang
Also filed as: CHANG SHIH-TZUNG
14 granted patents·123 citations·filing 1999–2015
92Inventor score
Top patents by PatentIndex Score
14 records- 0178US9275918B2Statistical method for monitoring manufacturing equipment and processing operationsWAFERTECH LLC·Filed 2015·Granted Mar 1, 2016·3 cites·15 claims
- 0278US6828226B1Removal of SiON residue after CMPTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 7, 2004·24 cites·28 claims
- 0376US9280151B2Recipe management system and methodCHANG SHIH-TZUNG·Filed 2012·Granted Mar 8, 2016·7 cites·21 claims
- 0468US7071100B2Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene processCHEN KEI-WEI·Filed 2004·Granted Jul 4, 2006·20 cites·22 claims
- 0568US6531382B1Use of a capping layer to reduce particle evolution during sputter pre-clean proceduresTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 11, 2003·16 cites·22 claims
- 0664US7026233B2Method for reducing defects in post passivation interconnect processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 11, 2006·12 cites·25 claims
- 0762US9064788B1Statistical method for monitoring manufacturing equipment and processing operationsWAFERTECH LLC·Filed 2014·Granted Jun 23, 2015·1 cites·15 claims
- 0859US6626741B2Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 30, 2003·7 cites·15 claims
- 0957US6769959B2Method and system for slurry usage reduction in chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 3, 2004·7 cites·20 claims
- 1055US7199045B2Metal-filled openings for submicron devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 3, 2007·6 cites·18 claims
- 1153US7128821B2Electropolishing method for removing particles from wafer surfaceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 31, 2006·4 cites·19 claims
- 1250US7304728B2Test device and method for laser alignment calibrationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 4, 2007·3 cites·13 claims
- 1349US6174454B1Slurry formulation for selective CMP of organic spin-on-glass insulating layer with low dielectric constantNAT SCIENCE COUNCIL·Filed 1999·Granted Jan 16, 2001·13 cites·9 claims
- 1444US7528478B2Semiconductor devices having post passivation interconnections and a buffer layerTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted May 5, 2009·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →