Inventor · disambiguated record
Shou-Zen Chang
Also filed as: CHANG SHOU Z · CHANG SHOU-ZEN
83 granted patents·21 pending applications·558 citations·filing 1998–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD50POWERCHIP SEMICONDUCTOR MFG CORP28TAIWAN SEMICONDUCTOR MFG10IMEC4IMEC INTER UNI MICRO ELECTR4
Top patents by PatentIndex Score
104 records- 0198US10354964B2Integrated devices in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·21 cites·20 claims
- 0297US11855333B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0397US11335655B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·4 cites·20 claims
- 0497US10186492B1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·16 cites·20 claims
- 0596US8012827B2Method for fabricating a dual workfunction semiconductor device and the device made thereofIMEC·Filed 2009·Granted Sep 6, 2011·131 cites·17 claims
- 0695US10157807B2Sensor packages and manufacturing mehtods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·10 cites·19 claims
- 0793US11610621B1Oxide semiconductor-based FRAMPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2021·Granted Mar 21, 2023·2 cites·6 claims
- 0893US10483617B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·7 cites·20 claims
- 0992US10636713B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·5 cites·20 claims
- 1091US9818722B1Package structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·7 cites·20 claims
- 1191US8551841B2IO ESD device and methods for forming the sameLEE TUNG YING·Filed 2012·Granted Oct 8, 2013·12 cites·12 claims
- 1291US2025364272A1Semiconductor device and manufacturing method thereofPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
- 1390US10971460B2Integrated devices in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·3 cites·20 claims
- 1490US10043761B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 7, 2018·5 cites·20 claims
- 1589US10510714B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
- 1688US10050013B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 14, 2018·5 cites·20 claims
- 1787US10475757B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 12, 2019·3 cites·20 claims
- 1887US10312203B2Structure and formation method of chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·4 cites·20 claims
- 1987US6037204ASilicon and arsenic double implanted pre-amorphization process for salicide technologyTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Mar 14, 2000·94 cites·26 claims
- 2086US12266847B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 2186US12266619B2Integrated devices in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 2286US11705411B2Chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 2386US10163824B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·4 cites·15 claims
- 2486US8754486B2IO ESD device and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 17, 2014·7 cites·17 claims
- 2585US6030863AGermanium and arsenic double implanted pre-amorphization process for salicide technologyTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Feb 29, 2000·77 cites·24 claims
- 2684US10276920B2Package structure, electronic device and method of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·20 claims
- 2783US10978782B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 13, 2021·1 cites·20 claims
- 2883US6303448B1Method for fabricating raised source/drain structuresTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Oct 16, 2001·55 cites·12 claims
- 2982US11211358B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 3082US11004809B2Chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 3182US2024379382A1Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3281US12009575B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 3381US2025192080A1Integrated Devices in Semiconductor Packages and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3480US10825508B1Bit line structure for two-transistor static random access memoryPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2019·Granted Nov 3, 2020·4 cites·8 claims
- 3579US9105744B2Semiconductor devices having inactive fin field effect transistor (FinFET) structures and manufacturing and design methods thereofLEE TUNG YING·Filed 2012·Granted Aug 11, 2015·4 cites·18 claims
- 3678US9601439B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 21, 2017·3 cites·20 claims
- 3778US8759920B2Semiconductor device and method of forming the sameWANN CLEMENT HSINGJEN·Filed 2012·Granted Jun 24, 2014·4 cites·16 claims
- 3877US10510681B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 3976US11749626B2Integrated devices in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 4076US11515618B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 29, 2022·0 cites·20 claims
- 4176US7759748B2Semiconductor device with reduced diffusion of workfunction modulating elementIMEC·Filed 2007·Granted Jul 20, 2010·7 cites·23 claims
- 4273US11658392B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 4373US9236253B2Strained structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 12, 2016·2 cites·19 claims
- 4472US2025300024A1Wafer structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2025·Application pending·0 cites
- 4571US12046480B2Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·20 claims
- 4671US11502077B2Semiconductor devices having fin field effect transistor (FinFET) structures and manufacturing and design methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·0 cites·20 claims
- 4771US10163854B2Package structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·1 cites·20 claims
- 4870US11721378B2Oxide semiconductor-based FRAMPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2023·Granted Aug 8, 2023·0 cites·6 claims
- 4969US10727082B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 28, 2020·1 cites·20 claims
- 5069US6121139ATi-rich TiN insertion layer for suppression of bridging during a salicide procedureTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Sep 19, 2000·28 cites·20 claims
Showing the top 50 of 104 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →