Inventor · disambiguated record
Shang-Yu Chang Chien
Also filed as: CHANG CHIEN SHANG-YU
44 granted patents·26 pending applications·60 citations·filing 2007–2025
96Inventor score
Files withPOWERTECH TECHNOLOGY INC66APTOS TECH INC1APTOS TECHNOLOGY INC1CHANG CHIEN SHANG-YU1GLOBAL MIXED MODE TECHNOLOGY INC1
Top patents by PatentIndex Score
70 records- 0196US11127699B2Chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Sep 21, 2021·4 cites·18 claims
- 0295US11569210B2Package structure having a first connection circuit and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Jan 31, 2023·4 cites·19 claims
- 0392US10515936B1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Dec 24, 2019·10 cites·8 claims
- 0489US11309283B2Packaging structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Apr 19, 2022·2 cites·14 claims
- 0586US10593647B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Mar 17, 2020·4 cites·9 claims
- 0685US11309296B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Apr 19, 2022·4 cites·13 claims
- 0784US10141276B2Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Nov 27, 2018·3 cites·9 claims
- 0883US10796931B2Manufacturing method of package structurePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Oct 6, 2020·3 cites·15 claims
- 0982US10950593B2Package structure including at least one connecting module and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Mar 16, 2021·3 cites·13 claims
- 1081US7843146B2LED dimming control circuitGLOBAL MIXED MODE TECHNOLOGY INC·Filed 2008·Granted Nov 30, 2010·9 cites·12 claims
- 1180US10978408B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 13, 2021·3 cites·13 claims
- 1278US11088100B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 1376US10629559B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 21, 2020·2 cites·10 claims
- 1474US10276526B2Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Apr 30, 2019·1 cites·11 claims
- 1573US11456243B2Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·0 cites·19 claims
- 1673US11211321B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Dec 28, 2021·0 cites·17 claims
- 1772US11545424B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jan 3, 2023·0 cites·14 claims
- 1872US11532575B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Dec 20, 2022·1 cites·19 claims
- 1972US11367678B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jun 21, 2022·0 cites·16 claims
- 2070US10840200B2Manufacturing method of chip package structure comprising encapsulant having concave surfacePOWERTECH TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·1 cites·15 claims
- 2168US11088080B2Chip package structure using silicon interposer as interconnection bridgePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Aug 10, 2021·1 cites·10 claims
- 2266US10438931B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Oct 8, 2019·1 cites·13 claims
- 2364US9082943B2Optoelectronic package and method of manufacturing the sameAPTOS TECHNOLOGY INC·Filed 2013·Granted Jul 14, 2015·2 cites·22 claims
- 2462US11296041B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Apr 5, 2022·0 cites·8 claims
- 2562US2025125206A1Chip package and method of manufacturing the samePOWERTECH TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2660US2024339443A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2760US2024347438A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2859US10756065B2Method thereof of package structurePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Aug 25, 2020·0 cites·16 claims
- 2959US2024313024A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3059US2024347348A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3158US12400979B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2022·Granted Aug 26, 2025·0 cites·17 claims
- 3256US2024274566A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3355US11211350B2Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Dec 28, 2021·0 cites·18 claims
- 3455US2023290730A1Package device and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3554US11637071B2Package structure including multiple dies surrounded by conductive element and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Apr 25, 2023·0 cites·17 claims
- 3653US11916035B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Feb 27, 2024·0 cites·18 claims
- 3753US11769763B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Sep 26, 2023·0 cites·14 claims
- 3852US12469833B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 3952US12154863B2Fan-out semiconductor package and method for manufacturing the samePOWERTECH TECHNOLOGY INC·Filed 2021·Granted Nov 26, 2024·0 cites·12 claims
- 4052US11251170B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Feb 15, 2022·0 cites·20 claims
- 4151US11990494B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted May 21, 2024·0 cites·5 claims
- 4251US11973037B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Apr 30, 2024·0 cites·16 claims
- 4351US2019164948A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 4450US11545423B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jan 3, 2023·0 cites·14 claims
- 4550US10163834B2Chip package structure comprising encapsulant having concave surfacePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·0 cites·10 claims
- 4650US2024371785A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4749US10177011B2Chip packaging method by using a temporary carrier for flattening a multi-layer structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jan 8, 2019·0 cites·13 claims
- 4849US2018301418A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 4949US2023110079A1Fan-out package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 5049US2025385210A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2025·Application pending·0 cites
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →