Inventor · disambiguated record
Shyng-Yeuan Che
Also filed as: CHE SHYNG-YEUAN
13 granted patents·1 pending application·13 citations·filing 1999–2023
85Inventor score
Files withPOWERCHIP SEMICONDUCTOR MFG CORP8POWERCHIP TECH CORP2POWERCHIP TECHNOLOGY CORP2WINBOND ELECTRONICS CORP2
Top patents by PatentIndex Score
14 records- 0180US9391107B1Image sensorPOWERCHIP TECHNOLOGY CORP·Filed 2015·Granted Jul 12, 2016·4 cites·12 claims
- 0266US11367728B2Memory structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted Jun 21, 2022·0 cites·7 claims
- 0365US11367727B2Memory structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted Jun 21, 2022·0 cites·6 claims
- 0459US12424477B2Wafer chuckPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2023·Granted Sep 23, 2025·0 cites·6 claims
- 0558US10868017B2Memory structure and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2019·Granted Dec 15, 2020·0 cites·5 claims
- 0656US12080590B2Manufacturing method of interconnect structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2022·Granted Sep 3, 2024·0 cites·10 claims
- 0755US9627468B2Capacitor structure and method of manufacturing the samePOWERCHIP TECH CORP·Filed 2015·Granted Apr 18, 2017·1 cites·19 claims
- 0853US2024162082A1Manufacturing method of semiconductor structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2023·Application pending·0 cites
- 0947US6194274B1Method of fabricating a mask ROMWINBOND ELECTRONICS CORP·Filed 2000·Granted Feb 27, 2001·4 cites·19 claims
- 1044US11069715B2Memory structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2019·Granted Jul 20, 2021·0 cites·14 claims
- 1141US10121848B2Method for manufacturing multilayer crown-shaped MIM capacitorPOWERCHIP TECHNOLOGY CORP·Filed 2017·Granted Nov 6, 2018·0 cites·6 claims
- 1239US11152367B1Semiconductor structure and integrated circuitPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted Oct 19, 2021·0 cites·14 claims
- 1339US9735228B2Multilayer crown-shaped MIM capacitor and manufacturing method thereofPOWERCHIP TECH CORP·Filed 2016·Granted Aug 15, 2017·0 cites·15 claims
- 1432US6297116B1Method for manufacturing a metal oxide semiconductor (MOS)-based structureWINBOND ELECTRONICS CORP·Filed 1999·Granted Oct 2, 2001·4 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →