Inventor · disambiguated record
Shih-Wei Chen
Also filed as: CHEN SHIH-WEI
53 granted patents·37 pending applications·50 citations·filing 2004–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD34TSMC SOLAR LTD23INVENTEC PUDONG TECH CORP6CHEN SHIH-WEI3YU TSUNG HSIU3
Top patents by PatentIndex Score
90 records- 0197US11515268B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 29, 2022·4 cites·20 claims
- 0296US11749640B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 0396US10510713B1Semicondcutor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·12 cites·20 claims
- 0495US11682626B2Chamfered die of semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·3 cites·20 claims
- 0594US12009281B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 11, 2024·2 cites·20 claims
- 0693US12002768B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 4, 2024·2 cites·20 claims
- 0792US11205636B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 21, 2021·2 cites·20 claims
- 0887US11916025B2Device die and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·1 cites·20 claims
- 0987US2024387498A1Manufacturing method of semiconductor package with thermal relaxation blockTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1086US8703524B1Indium sputtering method and materials for chalcopyrite-based material usable as solar cell absorber layersTSMC SOLAR LTD·Filed 2012·Granted Apr 22, 2014·3 cites·10 claims
- 1186US2025357384A1Method for fabricating device dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1285US11032932B1Mount assembly for expansion card and circuit assemblyINVENTEC PUDONG TECH CORP·Filed 2019·Granted Jun 8, 2021·4 cites·9 claims
- 1385US10811384B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·2 cites·20 claims
- 1484US12255196B2Semiconductor package with thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 1583US12381163B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 1683US2024371795A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1782US12125804B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1882US11282791B2Semiconductor device having a heat dissipation structure connected chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·2 cites·20 claims
- 1981US2025316616A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2080US11177192B2Semiconductor device including heat dissipation structure and fabricating method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·2 cites·20 claims
- 2180US2025183245A1Semiconductor package with thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2279US11824017B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 2379US11239135B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 1, 2022·2 cites·16 claims
- 2478US11830866B2Semiconductor package with thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 2578US8846438B2Method for indium sputtering and for forming chalcopyrite-based solar cell absorber layersTSMC SOLAR LTD·Filed 2014·Granted Sep 30, 2014·1 cites·20 claims
- 2678US2025239528A1Semiconductor device having a heat dissipation structure connected chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2777US11854986B2Chamfered die of semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2876US10720416B2Semiconductor package including thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·1 cites·20 claims
- 2976US2024088050A1Chamfered Die of Semiconductor Package and Method for Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3075US12300618B2Semiconductor device having a heat dissipation structure connected chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 3174US9272381B2Method for automatically inspecting and trimming a patch antennaCIROCOMM TECHNOLOGY CORP·Filed 2013·Granted Mar 1, 2016·2 cites·3 claims
- 3272US11309302B2Manufacturing method of semiconductor package including thermal conductive blockTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 3370US11694943B2Semiconductor device including heat dissipation structure and fabricating method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 3470US9410236B2Sputtering apparatus and methodTSMC SOLAR LTD·Filed 2012·Granted Aug 9, 2016·1 cites·20 claims
- 3567US8345035B2Liquid crystal display and display apparatusINNOCOM TECH SHENZHEN CO LTD·Filed 2009·Granted Jan 1, 2013·2 cites·14 claims
- 3663US9209341B2Thin film solar cell and method of forming sameTSMC SOLAR LTD·Filed 2014·Granted Dec 8, 2015·0 cites·20 claims
- 3762US12489064B2Method for forming mark, packaging method of semiconductor device, and semiconductor device having the markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 3862US2025022031A1Method for providing service-related dataYU TSUNG HSIU·Filed 2024·Application pending·0 cites
- 3961US2025173941A1Method and augmented reality device for providing augmented reality operating instructions for operating an apparatusYU TSUNG HSIU·Filed 2024·Application pending·0 cites
- 4060US9498799B2Method for removing non-bonding compound from polycrystalline materials on solar panelTSMC SOLAR LTD·Filed 2014·Granted Nov 22, 2016·0 cites·14 claims
- 4160US2015263205A1Cylindrical solar module and method of making the moduleTSMC SOLAR LTD·Filed 2014·Application pending·0 cites
- 4260US2015228820A1Front contact for a solar cell, and method of making sameTSMC SOLAR LTD·Filed 2014·Application pending·0 cites
- 4360US2015236183A1Solar cell and method of fabricating sameTSMC SOLAR LTD·Filed 2014·Application pending·0 cites
- 4459US11540761B2Systems and methods for facilitating exercise monitoring with real-time heart rate monitoring and motion analysisCM HK LTD·Filed 2019·Granted Jan 3, 2023·0 cites·23 claims
- 4559US2025104364A1Method and computing device for displaying virtual image to userYU TSUNG HSIU·Filed 2024·Application pending·0 cites
- 4659US2015024538A1Vapor dispensing apparatus and method for solar panelTSMC SOLAR LTD·Filed 2013·Application pending·0 cites
- 4759US2015017756A1Apparatus and method for producing cigs absorber layer in solar cellsTSMC SOLAR LTD·Filed 2013·Application pending·0 cites
- 4859US2015007868A1Enhanced photovoltaic performance with modified bus bar regionTSMC SOLAR LTD·Filed 2013·Application pending·0 cites
- 4958US2014251418A1Transparent conductive oxide layer with high-transmittance structures and methods of making the sameTSMC SOLAR LTD·Filed 2013·Application pending·0 cites
- 5058US2014352751A1Solar cell or tandem solar cell and method of forming sameTSMC SOLAR LTD·Filed 2013·Application pending·0 cites
Showing the top 50 of 90 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →