Inventor · disambiguated record
Shijie Chen
Also filed as: CHEN SHIJIE
19 granted patents·11 pending applications·68 citations·filing 1991–2023
91Inventor score
Files withHUAIAN IMAGING DEVICE MFT CORP6SILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD6WANG WENWU5SHANGHAI INST MATERIA MEDICA CAS3DELTA ELECTRONICS SHANGHAI CO2
Top patents by PatentIndex Score
30 records- 0189US9867275B2Modular power supply and method for manufacturing the sameDELTA ELECTRONICS SHANGHAI CO·Filed 2016·Granted Jan 9, 2018·15 cites·14 claims
- 0280US8410541B2CMOSFET device with controlled threshold voltage characteristics and method of fabricating the sameWANG WENWU·Filed 2010·Granted Apr 2, 2013·6 cites·15 claims
- 0379US11410854B2Lead frame, chip package structure, and manufacturing method thereofSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2020·Granted Aug 9, 2022·1 cites·15 claims
- 0477US8410555B2CMOSFET device with controlled threshold voltage and method of fabricating the sameWANG WENWU·Filed 2010·Granted Apr 2, 2013·5 cites·12 claims
- 0576US5253607AOne step molded all plastic boat and manufacture of the sameCHEN SHIJIE·Filed 1991·Granted Oct 19, 1993·30 cites·16 claims
- 0673US10971437B2Chip package structure and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2018·Granted Apr 6, 2021·2 cites·20 claims
- 0772US8507991B2Semiconductor device and method of manufacturing the sameWANG WENWU·Filed 2012·Granted Aug 13, 2013·3 cites·6 claims
- 0865US8222099B2Semiconductor device and method of manufacturing the sameWANG WENWU·Filed 2010·Granted Jul 17, 2012·2 cites·11 claims
- 0961US11605578B2Chip package assembly and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2021·Granted Mar 14, 2023·0 cites·11 claims
- 1059US8341980B2Integrated multiaxial articles: method, apparatus and fabricsSTONEFERRY TECHNOLOGY LLC·Filed 2011·Granted Jan 1, 2013·1 cites·31 claims
- 1156US2023378144A1Stacked packaging structure and power converterSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2023·Application pending·0 cites
- 1254US8624325B2Semiconductor device and method of manufacturing the sameWENWU WANG·Filed 2010·Granted Jan 7, 2014·2 cites·6 claims
- 1353US10950528B2Chip package assembly and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2019·Granted Mar 16, 2021·0 cites·9 claims
- 1453US8633098B2Method of manufacturing a semiconductor deviceHAN KAI·Filed 2010·Granted Jan 21, 2014·1 cites·6 claims
- 1553US2024033244A1Compositions and methods for inhibiting ythdf1SHANGHAI INST MATERIA MEDICA CAS·Filed 2021·Application pending·0 cites
- 1647US10699988B2Chip packaging method and package structureSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2018·Granted Jun 30, 2020·0 cites·8 claims
- 1744US10039214B2Heat spreader and power moduleDELTA ELECTRONICS SHANGHAI CO·Filed 2015·Granted Jul 31, 2018·0 cites·5 claims
- 1843US12172989B2Histone acetyltransferase (HAT) inhibitor and use thereofSHANGHAI INST MATERIA MEDICA CAS·Filed 2020·Granted Dec 24, 2024·0 cites·17 claims
- 1943US2020152551A1Stacked semiconductor devices and methods of manufacturing the sameHUAIAN IMAGING DEVICE MFT CORP·Filed 2019·Application pending·0 cites
- 2042US2020154058A1Image sensor and method of manufacturing the sameHUAIAN IMAGING DEVICE MFT CORP·Filed 2019·Application pending·0 cites
- 2140US2019123074A1Semiconductor Device and Preparation Method thereofHUAIAN IMAGING DEVICE MFT CORP·Filed 2018·Application pending·0 cites
- 2240US2025380344A1Driving circuit and method compatible with scr and wireless dimming, lamp, and systemHANGZHOU TUYA INFORMATION TECH CO LTD·Filed 2022·Application pending·0 cites
- 2340US2020043969A1Semiconductor device and method of manufacturing the sameHUAIAN IMAGING DEVICE MFT CORP·Filed 2019·Application pending·0 cites
- 2439US11427593B2Bromodomain inhibitor compound and use thereofSHANGHAI INST MATERIA MEDICA CAS·Filed 2019·Granted Aug 30, 2022·0 cites·13 claims
- 2539US8161775B2Integrated hollow fabric structureMi zhong-xing·Filed 2011·Granted Apr 24, 2012·0 cites·22 claims
- 2636US8563415B2Semiconductor device and method of manufacturing the sameWANG WENWU·Filed 2010·Granted Oct 22, 2013·0 cites·11 claims
- 2735US2019237501A1Semiconductor device and manufacturing method thereofHUAIAN IMAGING DEVICE MFT CORP·Filed 2018·Application pending·0 cites
- 2834US2011254063A1Semiconductor device structure and method for manufacturing the sameINST OF MICROELECTRONICS CAS·Filed 2010·Application pending·0 cites
- 2934US2019189694A1Image Sensor and Forming Method ThereofHUAIAN IMAGING DEVICE MFT CORP·Filed 2018·Application pending·0 cites
- 3034US2011227163A1Semiconductor deviceINST OF MICROELECTRONICS CAS·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →