Inventor · disambiguated record
Shin-Kung Chen
Also filed as: CHEN SHIN-KUNG
4 granted patents·2 pending applications·22 citations·filing 2012–2021
64Inventor score
Top patents by PatentIndex Score
6 records- 0184US8703508B2Method for wafer-level testing diced multi-chip stacked packagesCHANG KAI-JUN·Filed 2012·Granted Apr 22, 2014·22 cites·15 claims
- 0267US11693043B2Test head assembly for semiconductor devicePOWERTECH TECHNOLOGY INC·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 0350US11608205B2Head of a tag devicePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Mar 21, 2023·0 cites·8 claims
- 0440US2022097891A1Manual labeling devicePOWERTECH TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 0538US9250288B2Wafer-level testing method for singulated 3D-stacked chip cubesPOWERTECH TECHNOLOGY INC·Filed 2013·Granted Feb 2, 2016·0 cites·5 claims
- 0638US2022128623A1Device for over-the-air testingPOWERTECH TECHNOLOGY INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →