Inventor · disambiguated record
Shuo-Mao Chen
Also filed as: CHEN SHUO · CHEN SHUO-MAO
127 granted patents·33 pending applications·2,816 citations·filing 2003–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD144TAIWAN SEMICONDUCTOR MFG6CHEN SHUO-MAO4CHEN CHIA-CHUNG1CHEN CHUNG-HUI1
Top patents by PatentIndex Score
160 records- 0199US11270975B2Semiconductor packages including passive devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·9 cites·20 claims
- 0299US9048222B2Method of fabricating interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·1.1k cites·20 claims
- 0399US8680647B2Packages with passive devices and methods of forming the sameYU CHEN-HUA·Filed 2012·Granted Mar 25, 2014·594 cites·20 claims
- 0498US11942408B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·4 cites·20 claims
- 0598US11791301B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 17, 2023·3 cites·20 claims
- 0698US11581250B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·4 cites·20 claims
- 0798US10741537B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 11, 2020·36 cites·20 claims
- 0898US9460987B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·22 cites·20 claims
- 0998US8809996B2Package with passive devices and method of forming the sameCHEN SHUO-MAO·Filed 2012·Granted Aug 19, 2014·578 cites·19 claims
- 1097US11756928B2Multi-chip packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
- 1197US11735572B2Integrated circuit package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 22, 2023·5 cites·21 claims
- 1297US11393746B2Reinforcing package using reinforcing patchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·4 cites·20 claims
- 1397US11342255B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
- 1497US10804244B2Semiconductor package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 13, 2020·4 cites·20 claims
- 1597US10784220B2Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 22, 2020·17 cites·19 claims
- 1697US10535597B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·16 cites·20 claims
- 1797US9922903B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·12 cites·20 claims
- 1897US8115280B2Four-terminal gate-controlled LVBJTsCHEN CHIA-CHUNG·Filed 2010·Granted Feb 14, 2012·91 cites·14 claims
- 1997US7701038B2High-gain vertex lateral bipolar junction transistorTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Apr 20, 2010·81 cites·20 claims
- 2096US12125755B2Chip package structure with cavity in interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·2 cites·20 claims
- 2196US11848305B2Semiconductor packages including passive devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·2 cites·20 claims
- 2296US11282759B2Chip package structure having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·4 cites·20 claims
- 2396US10763239B2Multi-chip wafer level packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 1, 2020·13 cites·17 claims
- 2496US10546830B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 28, 2020·9 cites·20 claims
- 2596US10535632B2Semiconductor package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 14, 2020·15 cites·20 claims
- 2696US10515827B2Method for forming chip package with recessed interposer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·12 cites·20 claims
- 2795US12381180B2Multi-chip packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·1 cites·20 claims
- 2895US11915992B2Method for forming package structure with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 27, 2024·2 cites·20 claims
- 2995US11908764B2Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·20 claims
- 3094US10269685B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
- 3194US9245833B2Metal pads with openings in integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 26, 2016·14 cites·20 claims
- 3293US12218080B2Package structure with reinforced elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
- 3393US10283474B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·6 cites·20 claims
- 3493US9960106B2Package with metal-insulator-metal capacitor and method of manufacturing the sameChen shuo mao·Filed 2012·Granted May 1, 2018·13 cites·20 claims
- 3593US2025357432A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3692US11675957B2Integrated circuit stack verification method and system for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 3792US11456257B2Semiconductor package with dual sides of metal routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 27, 2022·6 cites·20 claims
- 3892US11037861B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·4 cites·20 claims
- 3992US10867924B2Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·6 cites·20 claims
- 4092US9040381B2Packages with passive devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·11 cites·20 claims
- 4191US12272629B2Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 8, 2025·2 cites·20 claims
- 4291US11935837B2Photonics integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 19, 2024·1 cites·20 claims
- 4391US11417620B2Semiconductor device encapsulated by molding material attached to redestribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·2 cites·20 claims
- 4491US11335672B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·20 claims
- 4591US11189596B2Methods of forming multi-chip wafer level packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·20 claims
- 4691US10163860B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·8 cites·20 claims
- 4791US9997471B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·6 cites·20 claims
- 4891US2025349644A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4990US11296065B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·2 cites·20 claims
- 5089US11443993B2Chip package structure with cavity in interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·20 claims
Showing the top 50 of 160 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →