Inventor · disambiguated record
Shiaw-Jong Steve Chen
Also filed as: CHEN SHIAW-JONG · CHEN SHIAW-JONG S · CHEN SHIAW-JONG STEVE
17 granted patents·630 citations·filing 1996–2000
95Inventor score
Top patents by PatentIndex Score
17 records- 0196US6394175B1Top mounted cooling device using heat pipesLUCENT TECHNOLOGIES INC·Filed 2000·Granted May 28, 2002·161 cites·21 claims
- 0295US6263957B1Integrated active cooling device for board mounted electric componentsLUCENT TECHNOLOGIES INC·Filed 2000·Granted Jul 24, 2001·145 cites·24 claims
- 0388US6317324B1Encapsulated power supply with a high thermal conductivity molded insertFiled 2000·Granted Nov 13, 2001·46 cites·25 claims
- 0482US6144557ASelf-locking conductive pin for printed wiring substrate electronics caseLUCENT TECHNOLOGIES INC·Filed 1999·Granted Nov 7, 2000·50 cites·12 claims
- 0578US6206708B1Through via plate electrical connector and method of manufacture thereofLUCENT TECHNOLOGIES INC·Filed 2000·Granted Mar 27, 2001·24 cites·12 claims
- 0674US6386844B1Miniature liquid transfer pump and method of manufacturing sameLUCENT TECHNOLOGIES INC·Filed 2000·Granted May 14, 2002·21 cites·24 claims
- 0771US5659462AEncapsulated, integrated power magnetic device and method of manufacture thereforLUCENT TECHNOLOGIES INC·Filed 1996·Granted Aug 19, 1997·35 cites·21 claims
- 0866US5872403APackage for a power semiconductor die and power supply employing the sameLUCENT TECHNOLOGIES INC·Filed 1997·Granted Feb 16, 1999·29 cites·15 claims
- 0964US6034441AOvercast semiconductor packageLUCENT TECHNOLOGIES INC·Filed 1997·Granted Mar 7, 2000·30 cites·22 claims
- 1063US6083772AMethod of mounting a power semiconductor die on a substrateLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jul 4, 2000·25 cites·10 claims
- 1155US6165596AMulti-layer insulated metal substrate printed wiring board having improved thermal coupling of componentsLUCENT TECHNOLOGIES INC·Filed 1999·Granted Dec 26, 2000·21 cites·12 claims
- 1250US6320762B1Fixed conductive pin for printed wiring substrate electronics case and method of manufacture thereforFiled 1999·Granted Nov 20, 2001·14 cites·21 claims
- 1350US5804952AEncapsulated package for a power magnetic device and method of manufacture thereforLUCENT TECHNOLOGIES INC·Filed 1996·Granted Sep 8, 1998·17 cites·28 claims
- 1442US6377466B1Header, a method of manufacture thereof and an electronic device employing the sameLUCENT TECHNOLOGIES INC·Filed 2000·Granted Apr 23, 2002·2 cites·21 claims
- 1539US6061260ABoard mounted power supply having an auxiliary outputLUCENT TECHNOLOGY INC·Filed 1998·Granted May 9, 2000·8 cites·20 claims
- 1636US6301120B1Circuit board apparatusLUCENT TECHNOLOGIES INC·Filed 2000·Granted Oct 9, 2001·0 cites·3 claims
- 1730US6181577B1Auxiliary bias circuit for a power supply and a method of operation thereofLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jan 30, 2001·2 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →