Inventor · disambiguated record
Shanghsuan Chiang
Also filed as: CHIANG SHANGHSUAN
2 granted patents·2 pending applications·1 citations·filing 2020–2024
30Inventor score
Technology areasH10W
Files withHUAWEI TECH CO LTD4
Top patents by PatentIndex Score
4 records- 0170US11276645B2Encapsulation of a substrate electrically connected to a plurality of pin arraysHUAWEI TECH CO LTD·Filed 2020·Granted Mar 15, 2022·1 cites·16 claims
- 0250US12266617B2Chip package, electronic device, and chip package preparation methodHUAWEI TECH CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 0346US2023037617A1Packaging structure, electronic device, and chip packaging methodHUAWEI TECH CO LTD·Filed 2022·Application pending·0 cites
- 0445US2024178187A1Chip package structure and packaging method thereof, and electronic deviceHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →