Inventor · disambiguated record
Shih-Ming Chin
Also filed as: CHIN SHIH-MING
4 granted patents·48 citations·filing 2002–2022
67Inventor score
Top patents by PatentIndex Score
4 records- 0182US6541366B1Method for improving a solder bump adhesion bond to a UBM contact layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 1, 2003·48 cites·20 claims
- 0260US12183607B2Semiconductor process system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 0349US11302546B2Semiconductor process system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 12, 2022·0 cites·20 claims
- 0438US10509420B2Reticle purging system and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →