Inventor · disambiguated record
Shih-Chao Chiu
Also filed as: CHIU SHIH-CHAO
15 granted patents·15 pending applications·6 citations·filing 2013–2024
86Inventor score
Top patents by PatentIndex Score
30 records- 0173US2024429113A1Lidded semiconductor packageMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0269US10141266B2Method of fabricating semiconductor package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Nov 27, 2018·1 cites·20 claims
- 0368US9490225B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 8, 2016·2 cites·20 claims
- 0467US12080614B2Lidded semiconductor packageMEDIATEK INC·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 0563US9716060B2Package structure with an embedded electronic component and method of fabricating the package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jul 25, 2017·1 cites·12 claims
- 0661US12388194B2Antenna-in-module package-on-package with air trenchesMEDIATEK INC·Filed 2023·Granted Aug 12, 2025·0 cites·14 claims
- 0761US9082723B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jul 14, 2015·1 cites·19 claims
- 0860US9673140B2Package structure having a laminated release layer and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·1 cites·9 claims
- 0957US9510463B2Coreless packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 29, 2016·0 cites·9 claims
- 1055US2025293138A1Package structure and manufacturing method thereofASPEED TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1153US2017171981A1Method of fabricating substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
- 1252US10068842B2Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 4, 2018·0 cites·13 claims
- 1352US10002825B2Method of fabricating package structure with an embedded electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 19, 2018·0 cites·23 claims
- 1452US2016013123A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 1551US9899249B2Fabrication method of coreless packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·10 claims
- 1650US9735080B2Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 15, 2017·0 cites·8 claims
- 1749US10043757B2Semiconductor package structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·10 claims
- 1849US9905438B2Method of manufacturing package substrate and semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 27, 2018·0 cites·13 claims
- 1949US9640503B2Package substrate, semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 2, 2017·0 cites·17 claims
- 2049US2016081186A1Substrate structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2149US2018247891A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 2248US2017301658A1Fabrication method of package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2345US2021217707A1Semiconductor package having re-distribution layer structure on substrate componentMEDIATEK INC·Filed 2020·Application pending·0 cites
- 2444US2015325516A1Coreless packaging substrate, pop structure, and methods for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2544US2015333029A1Package substrate and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2643US2016071780A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2742US2015102484A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2841US2015179598A1Flip-chip packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2933US2016086879A1Package substrate and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 3031US2016093546A1Package stucture and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shih-Chao Chiu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →