Inventor · disambiguated record

Sheng-Huan Chiu

Also filed as: CHIU SHENG-HUAN

5 granted patents·2 pending applications·2 citations·filing 2018–2025

68Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD7

Top patents by PatentIndex Score

7 records

0182US12051634B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
0280US10573573B2Package and package-on-package structure having elliptical conductive columnsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·20 claims
0376US11756849B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·17 claims
0470US11404341B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
0569US2025349784A1Integrated Circuit Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0665US2025309159A1Shifting contact pad for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0759US12394735B2Shifting contact pad for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →