Inventor · disambiguated record

Shih Pei Chou

Also filed as: CHOU SHIH-PEI

85 granted patents·7 pending applications·427 citations·filing 2010–2025

99Inventor score

Technology areasH10W H10F H01L H10P H10D

Files withTAIWAN SEMICONDUCTOR MFG CO LTD84 TAIWAN SEMICONDUCTOR MFG4 CHEN U-TING1 CHOU SHIH PEI1 HO CHENG-YING1

Top patents by PatentIndex Score

92 records

0199US9437572B2Conductive pad structure for hybrid bonding and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 6, 2016·227 cites·20 claims
0298US11694979B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·4 cites·20 claims
0398US10163974B2Method of forming absorption enhancement structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·21 cites·20 claims
0496US10991667B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 27, 2021·9 cites·20 claims
0596US10304898B2Absorption enhancement structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 28, 2019·9 cites·20 claims
0695US12341115B2Bond pad structure with reduced step height and increased electrical isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 24, 2025·2 cites·20 claims
0795US11495489B2Method for forming a semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·3 cites·20 claims
0895US11031434B2Self aligned grids in BSI image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·4 cites·20 claims
0995US10395974B1Method for forming a thin semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 27, 2019·11 cites·20 claims
1095US9553020B2Interconnect structure for connecting dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 24, 2017·12 cites·20 claims
1194US10553474B1Method for forming a semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 4, 2020·6 cites·20 claims
1293US10038026B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·7 cites·20 claims
1393US2025357399A1Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1492US10804315B2Absorption enhancement structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·2 cites·20 claims
1592US9728570B2Deep trench isolation fabrication for BSI image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·7 cites·20 claims
1692US9666566B13DIC structure and method for hybrid bonding semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·9 cites·20 claims
1792US9653507B2Deep trench isolation shrinkage method for enhanced device performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·7 cites·21 claims
1892US9412719B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 9, 2016·10 cites·20 claims
1992US2025366238A1Method for forming light pipe structure with high quantum efficiencyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2089US11855159B2Method for forming thin semiconductor-on-insulator (SOI) substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·1 cites·20 claims
2189US11309342B2Dummy vertical transistor structure to reduce cross talk in pixel sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·2 cites·20 claims
2289US11217547B2Bond pad structure with reduced step height and increased electrical isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 4, 2022·4 cites·20 claims
2389US9754993B2Deep trench isolations and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·5 cites·20 claims
2488US9006080B2Varied STI liners for isolation structures in image sensing devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·8 cites·20 claims
2587US12424577B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
2687US12317613B2Self aligned grids in BSI image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
2786US12419124B2Method for forming light pipe structure with high quantum efficiencyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
2885US10510799B2Absorption enhancement structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·2 cites·20 claims
2985US8610227B2Formation of embedded micro-lensCHOU SHIH PEI·Filed 2010·Granted Dec 17, 2013·6 cites·20 claims
3084US12165911B2Method for forming a semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
3184US9536777B2Interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 3, 2017·5 cites·15 claims
3284US2025275263A1Method of forming self aligned grids in bsi image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3384US2024162269A1Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3483US12400984B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
3583US9842816B2Conductive pad structure for hybrid bonding and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 12, 2017·3 cites·20 claims
3683US2024363671A1Deep trench isolations and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3781US10128113B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·3 cites·20 claims
3881US9627326B2Method for forming alignment marks and structure of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·2 cites·20 claims
3981US9293392B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 22, 2016·4 cites·20 claims
4081US2025279380A1Bond pad structure with reduced step height and increased electrical isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4180US11830764B2Method for forming a semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
4280US10008531B2Varied STI liners for isolation structures in image sensing devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 26, 2018·3 cites·18 claims
4379US8502389B2CMOS image sensor and method for forming the sameHO CHENG-YING·Filed 2011·Granted Aug 6, 2013·7 cites·20 claims
4478US10312278B2Front side illuminated image sensor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·2 cites·19 claims
4577US11894410B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
4677US11769778B2Method for forming light pipe structure with high quantum efficiencyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
4777US11244981B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·1 cites·20 claims
4877US10096515B2Interconnect structure for stacked deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 9, 2018·3 cites·20 claims
4977US9536920B2Stacked image sensor having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 3, 2017·3 cites·20 claims
5076US9355964B2Method for forming alignment marks and structure of sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 31, 2016·2 cites·20 claims

Showing the top 50 of 92 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →