Inventor · disambiguated record
Shao Hsuan Chuang
Also filed as: CHUANG SHAO HSUAN
8 granted patents·2 pending applications·0 citations·filing 2019–2024
72Inventor score
Files withADVANCED SEMICONDUCTOR ENG10
Top patents by PatentIndex Score
10 records- 0174US2024168238A1Recessed portion in a substrate and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0273US11886015B2Recessed portion in a substrate and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jan 30, 2024·0 cites·10 claims
- 0367US11262506B1Recessed portion in a substrate and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 1, 2022·0 cites·8 claims
- 0466US2023027674A1Semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 0563US11848143B2Electronic device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 19, 2023·0 cites·18 claims
- 0658US11495557B2Semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
- 0752US11410957B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 9, 2022·0 cites·17 claims
- 0852US11411073B2Semiconductor package device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 9, 2022·0 cites·17 claims
- 0952US11107881B2Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layerADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 31, 2021·0 cites·8 claims
- 1045US11398442B2Bonding structure, package structure, and method for manufacturing package structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jul 26, 2022·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Shao Hsuan Chuang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →