Inventor · disambiguated record
Shankar Devasenathipathy
Also filed as: DEVASENATHIPATHY SHANKAR
21 granted patents·9 pending applications·33 citations·filing 2004–2025
91Inventor score
Top patents by PatentIndex Score
30 records- 0190US9282650B2Thermal compression bonding process cooling manifoldINTEL CORP·Filed 2013·Granted Mar 8, 2016·14 cites·13 claims
- 0286US11646244B2Socket loading mechanism for passive or active socket and package coolingINTEL CORP·Filed 2019·Granted May 9, 2023·4 cites·20 claims
- 0383US12266589B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
- 0483US11456232B2Thermal assemblies for multi-chip packagesINTEL CORP·Filed 2018·Granted Sep 27, 2022·4 cites·22 claims
- 0582US9748199B2Thermal compression bonding process cooling manifoldINTEL CORP·Filed 2016·Granted Aug 29, 2017·4 cites·16 claims
- 0677US12057369B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 0775US2025191998A1Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2025·Application pending·0 cites
- 0874US9943931B2High performance transient uniform cooling solution for thermal compression bonding processINTEL CORP·Filed 2016·Granted Apr 17, 2018·2 cites·8 claims
- 0968US11854935B2Enhanced base die heat path using through-silicon viasINTEL CORP·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 1066US10576590B2Torque controlled driver apparatus and methodINTEL CORP·Filed 2016·Granted Mar 3, 2020·2 cites·5 claims
- 1166US9434029B2High performance transient uniform cooling solution for thermal compression bonding processLI ZHIHUA·Filed 2011·Granted Sep 6, 2016·2 cites·36 claims
- 1265US11444003B2Integrated heat spreader with multiple channels for multichip packagesINTEL CORP·Filed 2018·Granted Sep 13, 2022·1 cites·20 claims
- 1361US2021375719A1Stacked die architectures with improved thermal managementINTEL CORP·Filed 2021·Application pending·0 cites
- 1454US11854931B2STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom dieINTEL CORP·Filed 2019·Granted Dec 26, 2023·0 cites·25 claims
- 1551US11923268B2Printed heat spreader structures and methods of providing sameINTEL CORP·Filed 2020·Granted Mar 5, 2024·0 cites·19 claims
- 1651US11901262B2Cooling solution including microchannel arrays and methods of forming the sameINTEL CORP·Filed 2019·Granted Feb 13, 2024·0 cites·16 claims
- 1751US11398414B2Sloped metal features for cooling hotspots in stacked-die packagesINTEL CORP·Filed 2018·Granted Jul 26, 2022·0 cites·11 claims
- 1851US10600699B2Apparatus for inspection of a package assembly with a thermal solutionINTEL CORP·Filed 2017·Granted Mar 24, 2020·0 cites·17 claims
- 1950US11581671B2Integrated circuit package socket housing to enhance package coolingINTEL CORP·Filed 2019·Granted Feb 14, 2023·0 cites·20 claims
- 2047US11322456B2Die back side structures for warpage controlINTEL CORP·Filed 2017·Granted May 3, 2022·0 cites·20 claims
- 2146US2019214328A1Stacked die architectures with improved thermal managementEID FERAS·Filed 2018·Application pending·0 cites
- 2244US11679407B2Liquid metal thermal interface material applicationINTEL CORP·Filed 2020·Granted Jun 20, 2023·0 cites·9 claims
- 2344US2020111720A1Dual side die packaging for enhanced heat dissipationINTEL CORP·Filed 2018·Application pending·0 cites
- 2443US11502008B2Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage controlINTEL CORP·Filed 2017·Granted Nov 15, 2022·0 cites·13 claims
- 2543US2023290706A1Vapor chamber integrated heat spreader (ihs) with liquid reservoirINTEL CORP·Filed 2022·Application pending·0 cites
- 2642US2021125896A1Filled liquid metal thermal interface materialsINTEL CORP·Filed 2019·Application pending·0 cites
- 2740US2020176352A1Die backside structures for enhancing liquid cooling of high power multi-chip package (mcp) diceINTEL CORP·Filed 2017·Application pending·0 cites
- 2840US2020312741A1Thermoelectric cooler to enhance thermal-mechanical package performanceINTEL CORP·Filed 2019·Application pending·0 cites
- 2939US7341653B2Method and device for separating particleUNIV KEIO·Filed 2004·Granted Mar 11, 2008·0 cites·4 claims
- 3035US2020409398A1Device, system and method for providing microchannels with porous sidewall structuresINTEL CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →