Inventor · disambiguated record
Shaofeng Ding
Also filed as: DING SHAOFENG
34 granted patents·13 pending applications·40 citations·filing 2013–2025
95Inventor score
Top patents by PatentIndex Score
47 records- 0196US11538747B2Interposer structure, semiconductor package comprising the same, and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·6 cites·19 claims
- 0293US11133266B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 28, 2021·3 cites·20 claims
- 0391US11043456B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 22, 2021·8 cites·20 claims
- 0489US12107034B2Semiconductor chip and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 1, 2024·2 cites·20 claims
- 0589US11139286B2Semiconductor device including a capacitor structure and a thin film resistor and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 5, 2021·6 cites·9 claims
- 0685US12279408B2Semiconductor device and stack of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Apr 15, 2025·0 cites·20 claims
- 0784US12328882B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jun 10, 2025·0 cites·5 claims
- 0883US12199016B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 0983US11114524B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 7, 2021·3 cites·20 claims
- 1083US2025006594A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1183US2025275159A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1283US2025014968A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1383US2025267882A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1482US11728311B2Semiconductor devices including interposer substrates further including capacitorsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·1 cites·20 claims
- 1581US11268140B2Delayed pyrophosphorolysis activated polymerizationDING SHAOFENG·Filed 2019·Granted Mar 8, 2022·1 cites·2 claims
- 1681US10867908B2Semiconductor device having buffer structure surrounding through viaSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 1781US2025220874A1Semiconductor device and stack of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1881US2025220873A1Semiconductor device and stack of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1979US11094624B2Semiconductor device having capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 17, 2021·3 cites·13 claims
- 2076US10892318B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 12, 2021·2 cites·19 claims
- 2175US11871553B2Semiconductor device and stack of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
- 2275US9831139B2Test structure and method of manufacturing structure including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 28, 2017·2 cites·20 claims
- 2374US11961882B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·10 claims
- 2473US11876038B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·11 claims
- 2572US2025034546A1Deblocking chromatography and cassette for isolating nucleic acids from liquid biopsy samplesDING SHAOFENG·Filed 2024·Application pending·0 cites
- 2669US9856524B2Lyophilized integrated composition for storage and manipulation of pyrophosphorolysis activated polymerizationDING SHAOFENG·Filed 2014·Granted Jan 2, 2018·0 cites·9 claims
- 2769US2024209428A1Pyrophosphorolysis activated fluorescence to measure PAP amplification of nucleic acidDING SHAOFENG·Filed 2024·Application pending·0 cites
- 2868US12408355B2Metal-insulator-metal capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·15 claims
- 2968US2024395672A1Semiconductor chip and semiconductor package including sameNAME SAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3064US10619197B2Lyophilized integrated composition for storage and manipulation of pyrophosphorolysis activated polymerizationDING SHAOFENG·Filed 2017·Granted Apr 14, 2020·0 cites·9 claims
- 3162US11845981B2Delayed pyrophosphorolysis activated polymerizationDING SHAOFENG·Filed 2022·Granted Dec 19, 2023·0 cites·3 claims
- 3260US11791267B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·8 claims
- 3360US9133491B2Pyrophosphorolysis-activated polymerization (PAP) using ribonucleic acid (RNA) templateDING SHAOFENG·Filed 2013·Granted Sep 15, 2015·0 cites·9 claims
- 3458US11955509B2Metal-insulator-metal capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·7 claims
- 3558US9926543B2Pyrophosphorolysis-activated polymerization (PAP) using ribonucleic acid (RNA) templateDING SHAOFENG·Filed 2015·Granted Mar 27, 2018·0 cites·1 claims
- 3656US2024178131A1Semiconductor device having through-via structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3755US11798883B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·11 claims
- 3852US11921049B2Pyrophosphorolysis activated fluorescence to measure PAP amplification of nucleic acidDING SHAOFENG·Filed 2019·Granted Mar 5, 2024·0 cites·8 claims
- 3949US2023131382A1Three-dimensional integrated circuit structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4049US2023260893A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4148US11437374B2Semiconductor device and stacked semiconductor chips including through contactsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·19 claims
- 4248US2023170289A1Interposer structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4347US12014935B2Interposer and method of manufacturing the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 18, 2024·0 cites·20 claims
- 4447US10513727B2Multiplex pyrophosphorolysis activated polymerization to amplify multiple almost-sequence-identical templates in a single reactionDING SHAOFENG·Filed 2017·Granted Dec 24, 2019·0 cites·16 claims
- 4547US9163230B2Chromatography column and method for isolating nucleic acidDING SHAOFENG·Filed 2013·Granted Oct 20, 2015·0 cites·18 claims
- 4646US11193167B2Multiplex pyrophosphorolysis activated polymerization to amplify multiple almost-sequence-identical templates in a single reactionDING SHAOFENG·Filed 2019·Granted Dec 7, 2021·0 cites·11 claims
- 4745US10535575B2Interposer, method of manufacturing interposer, and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →