Inventor · disambiguated record
Shu Dobashi
Also filed as: DOBASHI SHU
1 granted patent·2 pending applications·1 citations·filing 2007–2012
17Inventor score
Top patents by PatentIndex Score
3 records- 0158US8546511B2Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin compositionTAI MAKOTO·Filed 2007·Granted Oct 1, 2013·1 cites·5 claims
- 0245US2010186998A1Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin compositionARISAWA SEISAKUSHO KK·Filed 2010·Application pending·0 cites
- 0339US2014224529A1Fire-retardant resin composition, metal-clad base laminate for flexible printed circuit board utilizing said composition, cover lay, adhesive sheet for flexible printed circuit board and flexible printed circuit boardDOBASHI SHU·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shu Dobashi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →