Inventor · disambiguated record
Shinzo Eguchi
Also filed as: EGUCHI SHINZO
5 granted patents·78 citations·filing 1995–2001
79Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD5
Top patents by PatentIndex Score
5 records- 0170US5854745AMethod and apparatus for mounting electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Dec 29, 1998·42 cites·14 claims
- 0258US6439447B1Bump joining judging device and method, and semiconductor component production device and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Aug 27, 2002·23 cites·40 claims
- 0340US6328196B1Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 11, 2001·8 cites·5 claims
- 0438US6481616B2Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 19, 2002·0 cites·7 claims
- 0535US5899140ABump levelling method and bump levelling apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted May 4, 1999·5 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Shinzo Eguchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →