Inventor · disambiguated record
Shien-Ping Feng
Also filed as: FENG SHIEN-PING
11 granted patents·6 pending applications·33 citations·filing 2003–2024
84Inventor score
Files withUNIV HONG KONG5TRIPOD TECHNOLOGY CORP4CHENG HAI-PENG1DOCTECH LTD1MASSACHUSETTS INST TECHNOLOGY1
Top patents by PatentIndex Score
17 records- 0186US8241372B2Electrochemical device and method of fabricating the sameCHENG HAI-PENG·Filed 2009·Granted Aug 14, 2012·18 cites·8 claims
- 0283US11578417B2Nano-twinned crystal film prepared by water/alcohol-soluble organic additives and method of fabricating the sameDOCTECH LTD·Filed 2020·Granted Feb 14, 2023·2 cites·9 claims
- 0367US12238945B2Dynamic urea bond-based passivators of perovskiteUNIV HONG KONG·Filed 2022·Granted Feb 25, 2025·0 cites·18 claims
- 0462US8298434B2Method of forming an electrode including an electrochemical catalyst layerWEI TZU-CHIEN·Filed 2009·Granted Oct 30, 2012·2 cites·14 claims
- 0561US8349394B2Method of forming an electrode including an electrochemical catalyst layerTRIPOD TECHNOLOGY CORP·Filed 2008·Granted Jan 8, 2013·1 cites·6 claims
- 0661US7183199B2Method of reducing the pattern effect in the CMP processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 27, 2007·10 cites·7 claims
- 0761US2024021574A1Cu-cu direct welding for packaging application in semiconductor industryUNIV HONG KONG·Filed 2023·Application pending·0 cites
- 0860US12429715B2Synthesis and application of light management with thermochromic hydrogel microparticlesMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Granted Sep 30, 2025·0 cites·11 claims
- 0955US11678579B2Stretchable ionic hydrogel with high thermopower for low-grade heat harvestingUNIV HONG KONG·Filed 2021·Granted Jun 13, 2023·0 cites·12 claims
- 1055US2023411347A1Cu-cu direct welding for packaging application in semiconductor industryUNIV HONG KONG·Filed 2021·Application pending·0 cites
- 1153US11626256B2Thermo-electric capacitorVERSITECH LTD·Filed 2019·Granted Apr 11, 2023·0 cites·7 claims
- 1252US2010071759A1Electrochemical Device and Method of Fabricating the SameTRIPOD TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 1349US2024321749A1Ic package with nanotwinning-assisted structurally stable copper structureUNIV CITY HONG KONG·Filed 2024·Application pending·0 cites
- 1448US10874020B2Imprinted metallization on polymeric substratesUNIV HONG KONG·Filed 2019·Granted Dec 22, 2020·0 cites·16 claims
- 1546US9183993B2One-pot synthesis of Nb2O5-doped TiO2 nanoparticlesNANO & ADVANCED MATERIALS INST LTD·Filed 2014·Granted Nov 10, 2015·0 cites·8 claims
- 1642US2010101623A1Packaging structureTRIPOD TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 1741US2010101644A1Electrolyte composition and dye-sensitized solar cell (dssc) comprising the sameTRIPOD TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →