Inventor · disambiguated record
Shao-Wen Fu
Also filed as: FU SHAO-WEN
0 granted patents·3 pending applications·0 citations·filing 2005–2006
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0141US2007102829A1Chip structure with solder bump and method for producing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 0231US2006199306A1Chip structure and manufacturing process thereofTSAI MON-CHIN·Filed 2005·Application pending·0 cites
- 0331US2006197191A1Chip structure and wafer structureTSAI MON-CHIN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →