Inventor · disambiguated record

Shin-Jiun Fu

Also filed as: FU SHIN-JIUN

0 granted patents·4 pending applications·0 citations·filing 2024–2025

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD4

Top patents by PatentIndex Score

4 records

0175US2025357340A1Integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0270US2025343188A1Arranging bond pads to reduce impact on passive devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0369US2025279358A1Integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0465US2025105185A1Arranging bond pads to reduce impact on passive devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →