Inventor · disambiguated record
Shunqiang Gong
Also filed as: GONG SHUNQIANG
14 granted patents·1 pending application·33 citations·filing 2012–2017
89Inventor score
Top patents by PatentIndex Score
15 records- 0181US8759947B2Back-side MOM/MIM devicesTAN JUAN BOON·Filed 2012·Granted Jun 24, 2014·8 cites·18 claims
- 0279US9711662B1Integrated circuits with optical modulators and photodetectors and methods for producing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted Jul 18, 2017·3 cites·20 claims
- 0379US9111941B2Non-volatile memory device with TSI/TSV applicationGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Aug 18, 2015·5 cites·20 claims
- 0476US10553488B2Device without zero mark layerGLOBALFOUNDRIES SG PTE LTD·Filed 2017·Granted Feb 4, 2020·2 cites·15 claims
- 0576US9362171B2Through via contacts with insulated substrateGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Jun 7, 2016·4 cites·20 claims
- 0675US9698200B2Magnetism-controllable dummy structures in memory deviceGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted Jul 4, 2017·2 cites·20 claims
- 0772US9806128B2Interposers for integrated circuits with multiple-time programming and methods for manufacturing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Oct 31, 2017·2 cites·20 claims
- 0871US8716856B2Device with integrated power supplyTAN JUAN BOON·Filed 2012·Granted May 6, 2014·3 cites·20 claims
- 0967US9240374B2Semiconductor device and method of forming thereofGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Jan 19, 2016·2 cites·20 claims
- 1065US9773702B2Device without zero mark layerGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Sep 26, 2017·1 cites·25 claims
- 1161US9799571B2Methods for producing integrated circuits with interposers and integrated circuits produced from such methodsGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Oct 24, 2017·1 cites·16 claims
- 1246US9437550B2TSV without zero alignment marksGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Sep 6, 2016·0 cites·20 claims
- 1344US10439021B2Capacitor structureGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted Oct 8, 2019·0 cites·15 claims
- 1444US10128201B2Seal ring for wafer level packageGLOBALFOUNDRIES SG PTE LTD·Filed 2017·Granted Nov 13, 2018·0 cites·20 claims
- 1534US2017054039A1Photonic devices with through dielectric via interposerGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →