Inventor · disambiguated record
Shih-Chin Gong
Also filed as: GONG SHIH-CHIN
15 granted patents·7 pending applications·85 citations·filing 2002–2024
90Inventor score
Top patents by PatentIndex Score
22 records- 0191US9137913B2Portable electronic device and cradleHSU WEI-CHIH·Filed 2013·Granted Sep 15, 2015·31 cites·16 claims
- 0290US11818563B2Package structure of micro speaker and method for forming the sameFORTEMEDIA INC·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0390US11665484B2Package structure of micro speakerFORTEMEDIA INC·Filed 2021·Granted May 30, 2023·2 cites·14 claims
- 0489US11051106B2Movable embedded microstructureFORTEMEDIA INC·Filed 2019·Granted Jun 29, 2021·3 cites·18 claims
- 0588US12170877B2Package structure of micro speaker and method for forming the sameFORTEMEDIA INC·Filed 2022·Granted Dec 17, 2024·2 cites·20 claims
- 0684US8102015B2Microphone package with minimum footprint size and thicknessGONG SHIH-CHIN·Filed 2008·Granted Jan 24, 2012·17 cites·18 claims
- 0765US12464289B2Micro speaker structure with novel magnet designFORTEMEDIA INC·Filed 2023·Granted Nov 4, 2025·0 cites·17 claims
- 0864US11995246B2Method for touchless gesture recognition, and apparatuses using the sameFORTEMEDIA INC·Filed 2023·Granted May 28, 2024·0 cites·14 claims
- 0962US6838303B2Silicon pressure sensor and the manufacturing method thereofASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Granted Jan 4, 2005·12 cites·7 claims
- 1061US12413909B2Package structure of micro speakerFORTEMEDIA INC·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 1159US6967145B2Method of maintaining photolithographic precision alignment after wafer bonding processASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Granted Nov 22, 2005·12 cites·4 claims
- 1258US9439309B2Electronic apparatus and controlling method thereofSHEN CHUN-TE·Filed 2013·Granted Sep 6, 2016·1 cites·22 claims
- 1355US2025358563A1Micro speaker structure with acoustic meshFORTEMEDIA INC·Filed 2024·Application pending·0 cites
- 1454US8351635B2Silicon-based microphone structure with electromagnetic interference shielding meansFORTEMEDIA INC·Filed 2008·Granted Jan 8, 2013·3 cites·19 claims
- 1550US12294845B2Package structure of micro speakerFORTEMEDIA INC·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 1646US2010086146A1Silicon-based microphone packageFORTEMEDIA INC·Filed 2008·Application pending·0 cites
- 1743US2008042223A1Microelectromechanical system package and method for making the sameLIAO LU-LEE·Filed 2006·Application pending·0 cites
- 1841US2008083958A1Micro-electromechanical system packageWEI WEN-CHIEH·Filed 2007·Application pending·0 cites
- 1940US2008083957A1Micro-electromechanical system packageWEI WEN-CHIEH·Filed 2006·Application pending·0 cites
- 2038US2006291674A1Method of making silicon-based miniaturized microphonesMERRY ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 2136US2008075308A1Silicon condenser microphoneWEI WEN-CHIEH·Filed 2006·Application pending·0 cites
- 2231US6864176B2Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement methodASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Granted Mar 8, 2005·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →