Inventor · disambiguated record

Shravan Gowrishankar

Also filed as: GOWRISHANKAR SHRAVAN

0 granted patents·2 pending applications·0 citations·filing 2016–2017

Technology areasH10W

Files withINTEL CORP2

Top patents by PatentIndex Score

2 records

0137US2021057348A1Barrier materials between bumps and padsINTEL CORP·Filed 2017·Application pending·0 cites
0232US2019237391A1Chip assemblies employing solder bonds to back-side lands including an electrolytic nickel layerINTEL CORP·Filed 2016·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Shravan Gowrishankar files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →