Inventor · disambiguated record
Shoji Hashizume
Also filed as: HASHIZUME SHOJI
9 granted patents·11 citations·filing 1991–2019
80Inventor score
Top patents by PatentIndex Score
9 records- 0174US10896826B2Method for fabricating semiconductor device and lead frameRENESAS ELECTRONICS CORP·Filed 2018·Granted Jan 19, 2021·2 cites·11 claims
- 0273US10504869B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 10, 2019·2 cites·11 claims
- 0365US8729512B2Optical coupling element and method for manufacturing the sameHASHIZUME SHOJI·Filed 2012·Granted May 20, 2014·1 cites·19 claims
- 0464US9831162B2Semiconductor device comprising a semiconductor chip mounted over a metal plate having an inclined surfaceRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 28, 2017·1 cites·19 claims
- 0552US10950527B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Mar 16, 2021·0 cites·8 claims
- 0652US10811281B2Manufacturing method of semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Oct 20, 2020·0 cites·8 claims
- 0748US10403513B2Manufacturing method of semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Sep 3, 2019·0 cites·7 claims
- 0848US10153230B2Method of manufacturing a semiconductor device comprising a semiconductor chip mounted over a metal plate having an inclined surfaceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·0 cites·10 claims
- 0924US5256900APackage for semiconductor device with at least one through holeNEC CORP·Filed 1991·Granted Oct 26, 1993·5 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →