Inventor · disambiguated record
Shinichi Hayakawa
Also filed as: HAYAKAWA SHINICHI
8 granted patents·4 pending applications·237 citations·filing 1980–2010
88Inventor score
Top patents by PatentIndex Score
12 records- 0192USD266479SMultipurpose toolHAYAKAWA IND CO LTD·Filed 1980·Granted Oct 12, 1982·78 cites·1 claims
- 0279US7201969B2Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the filmMITSUI CHEMICALS INC·Filed 2003·Granted Apr 10, 2007·26 cites·4 claims
- 0376US4932429AScrew stopper including anti-freeze device used for water pipe valveWATANABE MASATOSHI·Filed 1989·Granted Jun 12, 1990·39 cites·1 claims
- 0474US7954848B2InflatorTOYODA GOSEI KK·Filed 2010·Granted Jun 7, 2011·6 cites·2 claims
- 0573US4384390ABuckle for beltHAYAKAWA IND·Filed 1980·Granted May 24, 1983·44 cites·8 claims
- 0671US4529111ABuckle for a beltHAYAKAWA IND·Filed 1982·Granted Jul 16, 1985·40 cites·5 claims
- 0758US7780193B2Gas generatorTOYODA GOSEI KK·Filed 2006·Granted Aug 24, 2010·4 cites·16 claims
- 0841US2008217895A1Gas GeneratorNIPPON KAYAKU KK·Filed 2006·Application pending·0 cites
- 0936US2007167003A1Adhesive film and method for forming metal film using sameMITSUI CHEMICALS INC·Filed 2004·Application pending·0 cites
- 1035US7238421B2Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive filmMITSUI CHEMICALS INC·Filed 2003·Granted Jul 3, 2007·0 cites·4 claims
- 1135US2005244631A1Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the sameMITSUI CHEMICALS INC·Filed 2005·Application pending·0 cites
- 1233US2003064579A1Surface protecting adhesive film for semiconductor wafer and protecting method for semiconductor wafer using said adhesive filmFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →